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Patent applications and USPTO patent grants for Schutz; Ronald J..The latest application filed is for "structure for stopping mechanical cracks in a substrate wafer, use of the structure and a method for producing the structure".
Patent | Date |
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Structure for stopping mechanical cracks in a substrate wafer, use of the structure and a method for producing the structure App 20070221613 - Gutsche; Martin Ulrich ;   et al. | 2007-09-27 |
Nitride and polysilicon interface with titanium layer App 20060001162 - Schutz; Ronald J. ;   et al. | 2006-01-05 |
Aluminum metallization doped with iron and copper to prevent electromigration Grant 5,243,221 - Ryan , et al. September 7, 1 | 1993-09-07 |
Process for fabricating integrated circuits having shallow junctions Grant 5,008,217 - Case , et al. April 16, 1 | 1991-04-16 |
Selective etching process Grant 4,871,420 - Alexander, Jr. , et al. October 3, 1 | 1989-10-03 |
Interferometric methods and apparatus for device fabrication Grant 4,680,084 - Heimann , et al. July 14, 1 | 1987-07-14 |
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