SCHULZE; Jurgen

Patent Applications and Registrations

Patent applications and USPTO patent grants for SCHULZE; Jurgen.The latest application filed is for "component handling device for component handling, and injection-moulding machine equipped therewith".

Company Profile

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SCHULZE; Jurgen - Altdorf DE
Schulze; Jurgen - Potsdam DE
Schulze; Jurgen - Berlin DE
Schulze; Jurgen - Bergholz-Rehbrucke DE
Schulze; Jurgen - D-14482 Potsdam DE
Schulze; Jurgen - Nuremberg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Component Handling Device For Component Handling, And Injection-moulding Machine Equipped Therewith App 20220177237 - SCHULZE; Jurgen	2022-06-09
Solder paste Grant 10,456,871 - Fritzsche , et al. Oc	2019-10-29
Method for producing a soldered connection Grant 10,456,870 - Fritzsche , et al. Oc	2019-10-29
Method For Producing A Soldered Connection App 20170252869 - FRITZSCHE; Sebastian ; et al.	2017-09-07
Solder Paste App 20170252873 - FRITZSCHE; Sebastian ; et al.	2017-09-07
Method For Modifying The Operating Mode Of A Technical Communications Group Platform (tcgpl) Of A Telecommunications Network (tc Network) App 20110256847 - Schindler; Sigram ; et al.	2011-10-20
Method for modifying the operating mode of a technical communications group platform (TCGPL) of a telecommunications network (TC network) Grant 7,873,720 - Schindler , et al. January 18, 2	2011-01-18
Method for modifying the operating mode of a technical communications group platform (TCGPL) of a telecommunications network (TC network) App 20070245301 - Schindler; Sigram ; et al.	2007-10-18
Lipopolysaccharides (LPS) extracted from Escherichia coli Grant 6,833,451 - Proppert , et al. December 21, 2	2004-12-21
Lipopolysaccharides (lps) extracted from escherichia coli App 20030108573 - Proppert, Hans ; et al.	2003-06-12
Device for producing soft solder App 20020109273 - Schulze, Jurgen ; et al.	2002-08-15
Method for encapsulating solder metal powders and solder metal powders produced according to this method Grant 6,416,863 - Schulze , et al. July 9, 2	2002-07-09
Ribbon cassette Grant 4,810,116 - Schulze , et al. March 7, 1	1989-03-07
Procedure for the production of a granulated infant milk food product Grant 4,692,340 - Grutte , et al. September 8, 1	1987-09-08
Perfluoroolefin and perfluoroparaffin mixture and process for making same Grant 4,225,404 - Dietrich , et al. September 30, 1	1980-09-30

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