Schulz; Gernot

Patent Applications and Registrations

Patent applications and USPTO patent grants for Schulz; Gernot.The latest application filed is for "component carrier having at least a part formed as a three-dimensionally printed structure forming an antenna".

Company Profile

7.7.12

Schulz; Gernot - Graz AT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Aligning component carrier structure with known-good sections and critical section with other component carrier with components and dummies Grant 11,430,703 - Gavagnin , et al. August 30, 2	2022-08-30
Component carrier with integrated flux gate sensor Grant 11,366,181 - Schulz , et al. June 21, 2	2022-06-21
Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed Structure Forming an Antenna App 20220190464 - Gavagnin; Marco ; et al.	2022-06-16
Component carrier comprising a double layer structure Grant 11,197,367 - Gavagnin , et al. December 7, 2	2021-12-07
Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portions Grant 11,058,007 - Gavagnin , et al. July 6, 2	2021-07-06
Aligning Component Carrier Structure With Known-Good Sections and Critical Section With Other Component Carrier With Components and Dummies App 20200357706 - Gavagnin; Marco ; et al.	2020-11-12
Component Carrier Comprising a Double Layer Structure App 20200329555 - Gavagnin; Marco ; et al.	2020-10-15
Package With Embedded Electronic Component Being Encapsulated in a Pressureless Way App 20200111717 - Gmunder; Gernot ; et al.	2020-04-09
Component Carrier With Integrated Flux Gate Sensor App 20200041582 - Schulz; Gernot ; et al.	2020-02-06
Component Carrier With Two Component Carrier Portions and a Component Being Embedded in a Blind Opening of One of the Component Carrier Portions App 20190141836 - Gavagnin; Marco ; et al.	2019-05-09
Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed Structure App 20190110366 - Gavagnin; Marco ; et al.	2019-04-11
Printed circuit board structure Grant 10,225,920 - Kasper , et al.	2019-03-05
Mechanically stable, thermally conductive and electrically insulating stack forming a mounting device for electronic components Grant 10,109,554 - Kreutzwiesner , et al. October 23, 2	2018-10-23
Warpage control with intermediate material Grant 9,867,284 - Kreutzwiesner , et al. January 9, 2	2018-01-09
Adhesion Promoting Material-Coated Electrically Conductive Carrier With Thermally Conductive Layer App 20170245358 - Kreutzwiesner; Elisabeth ; et al.	2017-08-24
Mechanically Stable, Thermally Conductive And Electrically Insulating Stack For Mounting Device App 20170229370 - Kreutzwiesner; Elisabeth ; et al.	2017-08-10
Warpage Control With Intermediate Material App 20170231086 - Kreutzwiesner; Elisabeth ; et al.	2017-08-10
Reinforcement Structures With a Thermal Conductivity-Increasing Coating in the Resin Matrix, and Electrical Conductor Structure Which is Separate From the Coating App 20170142830 - Kreutzwiesner; Elisabeth ; et al.	2017-05-18
Heat Spreader in Multilayer Build Ups App 20170079130 - Schulz; Gernot ; et al.	2017-03-16

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