Patent applications and USPTO patent grants for Schultz; Mark D..The latest application filed is for "cold plate with uniform plenum flow".
Patent | Date |
---|---|
Reduced Pressure Drop Cold Plate Transition App 20220205740 - Schultz; Mark D. | 2022-06-30 |
Cold Plate With Uniform Plenum Flow App 20220210946 - Schultz; Mark D. ;   et al. | 2022-06-30 |
Wafer scale supercomputer Grant 11,335,657 - Colgan , et al. May 17, 2 | 2022-05-17 |
Pump drive system Grant 11,300,112 - Janecek , et al. April 12, 2 | 2022-04-12 |
Pattern bonded finned cold plate Grant 11,278,978 - Schultz March 22, 2 | 2022-03-22 |
Wafer Scale Supercomputer App 20220084969 - Colgan; Evan ;   et al. | 2022-03-17 |
Energy efficiency based control for a cooling system Grant 11,277,944 - Chainer , et al. March 15, 2 | 2022-03-15 |
Module lid with embedded two-phase cooling and insulating layer Grant 11,201,102 - Parida , et al. December 14, 2 | 2021-12-14 |
Compliant pin fin heat sink and methods Grant 11,158,565 - Karidis , et al. October 26, 2 | 2021-10-26 |
Pump Drive System App 20210301801 - Janecek; Thomas F. ;   et al. | 2021-09-30 |
Burst resistant thin wall heat sink Grant 11,131,506 - Coteus , et al. September 28, 2 | 2021-09-28 |
Large channel interconnects with through silicon Vias (TSVs) and method for constructing the same Grant 11,127,715 - Andry , et al. September 21, 2 | 2021-09-21 |
Data Center Coolant Switch App 20210243919 - Iyengar; Madhusudan K. ;   et al. | 2021-08-05 |
Data center coolant switch Grant 11,013,152 - Iyengar , et al. May 18, 2 | 2021-05-18 |
Compliant Pin Fin heat sink with base integral pins Grant 10,991,639 - Schultz April 27, 2 | 2021-04-27 |
Pattern Bonded Finned Cold Plate App 20200400387 - Schultz; Mark D. | 2020-12-24 |
High-density, fail-in-place switches for computer and data networks Grant 10,749,817 - Coteus , et al. A | 2020-08-18 |
Energy Efficiency Based Control For A Cooling System App 20200253092 - Kind Code | 2020-08-06 |
Counter-flow expanding channels for enhanced two-phase heat removal Grant 10,727,159 - Brunschwiler , et al. | 2020-07-28 |
Counter-flow expanding channels for enhanced two-phase heat removal Grant 10,727,158 - Brunschwiler , et al. | 2020-07-28 |
Mechanically Flexible Cold Plates For Low Power Components App 20200221610 - Coteus; Paul W. ;   et al. | 2020-07-09 |
Thermal Interface Formed By Condensate App 20200211924 - Schultz; Mark D. ;   et al. | 2020-07-02 |
Energy efficiency based control for a cooling system Grant 10,653,044 - Chainer , et al. | 2020-05-12 |
Mechanically flexible cold plates for low power components Grant 10,631,438 - Coteus , et al. | 2020-04-21 |
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal App 20200118907 - Brunschwiler; Thomas J. ;   et al. | 2020-04-16 |
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal App 20200091037 - Brunschwiler; Thomas J. ;   et al. | 2020-03-19 |
Data Center Coolant Switch App 20200029470 - Iyengar; Madhusudan K. ;   et al. | 2020-01-23 |
Counter-flow expanding channels for enhanced two-phase heat removal Grant 10,529,648 - Brunschwiler , et al. J | 2020-01-07 |
Module Lid with Embedded Two-Phase Cooling and Insulating Layer App 20190348345 - Parida; Pritish R. ;   et al. | 2019-11-14 |
Data center coolant switch Grant 10,440,862 - Iyengar , et al. O | 2019-10-08 |
High-density, fail-in-place switches for computer and data networks Grant 10,389,654 - Coteus , et al. A | 2019-08-20 |
Two-phase Liquid Cooled Electronics App 20190230816 - Chainer; Timothy J. ;   et al. | 2019-07-25 |
Data center coolant switch Grant 10,342,165 - Iyengar , et al. | 2019-07-02 |
Mechanically Flexible Cold Plates For Low Power Components App 20190200485 - Coteus; Paul W. ;   et al. | 2019-06-27 |
Burst Resistant Thin Wall Heat Sink App 20190154340 - Coteus; Paul W. ;   et al. | 2019-05-23 |
Large Channel Interconnects With Through Silicon Vias (tsvs) And Method For Constructing The Same App 20190139938 - Andry; Paul S. ;   et al. | 2019-05-09 |
Cold plate Grant 10,231,356 - Marroquin , et al. | 2019-03-12 |
Burst resistant thin wall heat sink Grant 10,222,125 - Coteus , et al. | 2019-03-05 |
Flexible cold plate with enhanced flexibility Grant 10,215,504 - Coteus , et al. Feb | 2019-02-26 |
High-density, Fail-in-place Switches For Computer And Data Networks App 20190020597 - Coteus; Paul W. ;   et al. | 2019-01-17 |
Large channel interconnects with through silicon vias (TSVs) and method for constructing the same Grant 10,177,116 - Andry , et al. J | 2019-01-08 |
Pin fin compliant heat sink with enhanced flexibility Grant 10,168,108 - Schultz J | 2019-01-01 |
Compliant Pin Fin Heat Sink And Methods App 20180240735 - Karidis; John P. ;   et al. | 2018-08-23 |
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal App 20180182686 - Brunschwiler; Thomas J. ;   et al. | 2018-06-28 |
Pin Fin Compliant Heat Sink With Enhanced Flexibility App 20180164048 - Schultz; Mark D. | 2018-06-14 |
Compliant pin fin heat sink and methods Grant 9,997,435 - Karidis , et al. June 12, 2 | 2018-06-12 |
Cold Plate App 20180124949 - MARROQUIN; Christopher M. ;   et al. | 2018-05-03 |
Pin fin compliant heat sink with enhanced flexibility Grant 9,939,210 - Schultz April 10, 2 | 2018-04-10 |
Counter-flow expanding channels for enhanced two-phase heat removal Grant 9,941,189 - Brunschwiler , et al. April 10, 2 | 2018-04-10 |
Near-chip compliant layer for reducing perimeter stress during assembly process Grant 9,922,900 - Schultz , et al. March 20, 2 | 2018-03-20 |
Cold plate Grant 9,894,801 - Marroquin , et al. February 13, 2 | 2018-02-13 |
Interlayer chip cooling apparatus Grant 9,875,953 - Chainer , et al. January 23, 2 | 2018-01-23 |
Heat sink for semiconductor modules Grant 9,831,151 - Schultz November 28, 2 | 2017-11-28 |
Compliant Pin Fin Heat Sink With Base Integral Pins App 20170287809 - SCHULTZ; Mark D. | 2017-10-05 |
Compliant Pin Fin Heat Sink And Methods App 20170236770 - KARIDIS; JOHN P. ;   et al. | 2017-08-17 |
Calibrating thermal behavior of electronics Grant 9,702,767 - Chainer , et al. July 11, 2 | 2017-07-11 |
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal App 20170179001 - Brunschwiler; Thomas J. ;   et al. | 2017-06-22 |
Near-chip Compliant Layer For Reducing Perimeter Stress During Assembly Process App 20170170092 - Schultz; Mark D. ;   et al. | 2017-06-15 |
Thermal management of optical coupling systems Grant 9,678,289 - Schultz , et al. June 13, 2 | 2017-06-13 |
Thermal Management Of Optical Coupling Systems App 20170160501 - Schultz; Mark D. ;   et al. | 2017-06-08 |
High-density, Fail-in-place Switches For Computer And Data Networks App 20170155598 - Coteus; Paul W. ;   et al. | 2017-06-01 |
High-density, fail-in-place switches for computer and data networks Grant 9,634,959 - Coteus , et al. April 25, 2 | 2017-04-25 |
Calibrating Thermal Behavior Of Electronics App 20170102273 - Chainer; Timothy J. ;   et al. | 2017-04-13 |
Near-chip compliant layer for reducing perimeter stress during assembly process Grant 9,570,373 - Schultz , et al. February 14, 2 | 2017-02-14 |
Calibrating thermal behavior of electronics Grant 9,534,967 - Chainer , et al. January 3, 2 | 2017-01-03 |
Flexible Cold Plate With Enhanced Flexibility App 20160290728 - Coteus; Paul W. ;   et al. | 2016-10-06 |
Burst Resistant Thin Wall Heat Sink App 20160290727 - Coteus; Paul W. ;   et al. | 2016-10-06 |
Calibrating Thermal Behavior Of Electronics App 20160252408 - Chainer; Timothy J. ;   et al. | 2016-09-01 |
Compliant pin fin heat sink and methods Grant 9,425,124 - Karidis , et al. August 23, 2 | 2016-08-23 |
Cooling apparatus with a resilient heat conducting member Grant 9,370,122 - Chainer , et al. June 14, 2 | 2016-06-14 |
Calibrating thermal behavior of electronics Grant 9,354,126 - Chainer , et al. May 31, 2 | 2016-05-31 |
Interlayer Chip Cooling Apparatus App 20160128232 - Chainer; Timothy J. ;   et al. | 2016-05-05 |
Pin Fin Compliant Heat Sink With Enhanced Flexibility App 20160091260 - Schultz; Mark D. | 2016-03-31 |
Data Center Coolant Switch App 20160021795 - Iyengar; Madhusudan K. ;   et al. | 2016-01-21 |
Data Center Coolant Switch App 20160021794 - Iyengar; Madhusudan K. ;   et al. | 2016-01-21 |
Information technology equipment cooling method Grant 9,167,728 - Schultz October 20, 2 | 2015-10-20 |
High-density, Fail-in-place Switches For Computer And Data Networks App 20150289406 - Coteus; Paul W. ;   et al. | 2015-10-08 |
Data center coolant switch Grant 9,151,543 - Iyengar , et al. October 6, 2 | 2015-10-06 |
Data center cooling method Grant 9,107,327 - Chainer , et al. August 11, 2 | 2015-08-11 |
Large Channel Interconnects With Through Silicon Vias (tsvs) And Method For Constructing The Same App 20150221613 - Andry; Paul S. ;   et al. | 2015-08-06 |
Dynamically limiting energy consumed by cooling apparatus Grant 9,052,722 - Chainer , et al. June 9, 2 | 2015-06-09 |
Dynamically limiting energy consumed by cooling apparatus Grant 9,043,035 - Chainer , et al. May 26, 2 | 2015-05-26 |
Data center cooling system Grant 8,978,401 - Chainer , et al. March 17, 2 | 2015-03-17 |
Cooling Apparatus With A Resilient Heat Conducting Member App 20140192476 - Chainer; Timothy J. ;   et al. | 2014-07-10 |
Energy Efficiency Based Control For A Cooling System App 20140190681 - Chainer; Timothy J. ;   et al. | 2014-07-10 |
Probe apparatus assembly and method Grant 8,760,186 - Schultz June 24, 2 | 2014-06-24 |
Information technology equipment cooling system Grant 8,746,000 - Schultz June 10, 2 | 2014-06-10 |
Calibrating Thermal Behavior Of Electronics App 20140153607 - Chainer; Timothy J. ;   et al. | 2014-06-05 |
Flexible heat sink with lateral compliance Grant 8,736,048 - Schultz May 27, 2 | 2014-05-27 |
Method of fabricating a cooled electronic system Grant 8,649,177 - Chainer , et al. February 11, 2 | 2014-02-11 |
Data Center Cooling Method App 20140020885 - Chainer; Timothy J. ;   et al. | 2014-01-23 |
Data Center Cooling System App 20140020418 - Chainer; Timothy J. ;   et al. | 2014-01-23 |
Information Technology Equipment Cooling Method App 20140020884 - Schultz; Mark D. | 2014-01-23 |
Information Technology Equipment Cooling System App 20140022725 - Schultz; Mark D. | 2014-01-23 |
Flexible Heat Sink With Lateral Compliance App 20130214406 - Schultz; Mark D. | 2013-08-22 |
Compliant Pin Fin Heat Sink And Methods App 20130199767 - Karidis; John P. ;   et al. | 2013-08-08 |
Cooled electronic system with thermal spreaders coupling electronics cards to cold rails Grant 8,493,738 - Chainer , et al. July 23, 2 | 2013-07-23 |
Dynamically Limiting Energy Consumed By Cooling Apparatus App 20130138252 - CHAINER; Timothy J. ;   et al. | 2013-05-30 |
Dynamically Limiting Energy Consumed By Cooling Apparatus App 20130138253 - CHAINER; Timothy J. ;   et al. | 2013-05-30 |
Data Center Coolant Switch App 20130014926 - Iyengar; Madhusudan K. ;   et al. | 2013-01-17 |
Method Of Fabricating A Cooled Electronic System App 20120279047 - CHAINER; Timothy J. ;   et al. | 2012-11-08 |
Cooled Electronic System With Thermal Spreaders Coupling Electronics Cards To Cold Rails App 20120281358 - CHAINER; Timothy J. ;   et al. | 2012-11-08 |
Method of full-field solder coverage by inverting a fill head and a mold Grant 8,286,855 - Budd , et al. October 16, 2 | 2012-10-16 |
Method Of Full-field Solder Coverage App 20120193833 - BUDD; Russell A. ;   et al. | 2012-08-02 |
Method of full-field solder coverage using a vacuum fill head Grant 8,181,846 - Budd , et al. May 22, 2 | 2012-05-22 |
Probe Apparatus Assembly And Method App 20110203108 - Schultz; Mark D. | 2011-08-25 |
Fill-head For Full-field Solder Coverage With A Rotatable Member App 20110203762 - BUDD; Russell A. ;   et al. | 2011-08-25 |
Fill head for full-field solder coverage with a rotatable member Grant 7,980,445 - Budd , et al. July 19, 2 | 2011-07-19 |
Reduced friction molds for injection molded solder processing Grant 7,931,249 - Schultz April 26, 2 | 2011-04-26 |
Step-down Transition Of A Solder Head In The Injection Molding Soldering Process App 20100252225 - Schultz; Mark D. | 2010-10-07 |
Method for step-down transition of a solder head in the injection molding soldering process Grant 7,757,932 - Schultz July 20, 2 | 2010-07-20 |
Management of data cartridges in multiple-cartridge cells in an automated data storage library Grant 7,751,141 - Chamorro , et al. July 6, 2 | 2010-07-06 |
Full-field Solder Coverage App 20090183849 - Budd; Russell A. ;   et al. | 2009-07-23 |
High Performance Compliant Thermal Interface Cooling Structures App 20090151893 - Karidis; John P. ;   et al. | 2009-06-18 |
Compliant Thermal Interface Design And Assembly Method App 20090151907 - Karidis; John P. ;   et al. | 2009-06-18 |
Management Of Data Cartridges In Multiple-cartridge Cells In An Automated Data Storage Library App 20090147394 - Chamorro; German A. ;   et al. | 2009-06-11 |
Cooling structure using rigid movable elements Grant 7,545,648 - Karidis , et al. June 9, 2 | 2009-06-09 |
Compliant thermal interface structure utilizing spring elements Grant 7,545,647 - Karidis , et al. June 9, 2 | 2009-06-09 |
Data storage cartridge gripper with deep-reach Grant 7,518,822 - Karidis , et al. April 14, 2 | 2009-04-14 |
Management of data cartridges in multiple-cartridge cells in an automated data storage library Grant 7,505,224 - Chamorro , et al. March 17, 2 | 2009-03-17 |
Cooling An Electronic Device Utilizing Spring Elements With Fins App 20080298016 - Karidis; John P. ;   et al. | 2008-12-04 |
Method And Apparatus For Increasing Visibility Of A Laser Pointer App 20080247165 - Schultz; Mark D. | 2008-10-09 |
Reduced Friction Molds For Injection Molded Solder Processing App 20080185118 - Schultz; Mark D. | 2008-08-07 |
Compliant thermal interface structure utilizing spring elements with fins Grant 7,408,780 - Karidis , et al. August 5, 2 | 2008-08-05 |
Cooling Structure Using Rigid Movable Elements App 20080170370 - Karidis; John P. ;   et al. | 2008-07-17 |
Virtual Pointer App 20080170033 - Schultz; Mark D. | 2008-07-17 |
Compliant Thermal Interface Structure Utilizing Spring Elements App 20080144288 - Karidis; John P. ;   et al. | 2008-06-19 |
Cooling structure using rigid movable elements Grant 7,362,582 - Karidis , et al. April 22, 2 | 2008-04-22 |
Compliant thermal interface structure utilizing spring elements Grant 7,355,855 - Karidis , et al. April 8, 2 | 2008-04-08 |
Method for step-down transition of a solder head in the injection molding soldering process App 20080048008 - Schultz; Mark D. | 2008-02-28 |
Compliant thermal cap for an electronic device Grant 7,304,849 - Schultz December 4, 2 | 2007-12-04 |
Multidimensional Compliant Thermal Cap for an Electronic Device App 20070272425 - Schultz; Mark D. | 2007-11-29 |
Management of data cartridges in multiple-cartridge cells in an automated data storage library App 20070211366 - Chamorro; German A. ;   et al. | 2007-09-13 |
Self-servo-writing multi-slot timing pattern Grant 7,268,963 - Chainer , et al. September 11, 2 | 2007-09-11 |
Multi-dimensional compliant thermal cap for an electronic device Grant 7,268,292 - Schultz September 11, 2 | 2007-09-11 |
Method and apparatus for providing combined radial and timing multislot self-servowrite propagation Grant 7,236,323 - Finstad , et al. June 26, 2 | 2007-06-26 |
Liquid cooling structure for electronic device Grant 7,188,667 - Schultz March 13, 2 | 2007-03-13 |
Compliant thermal interface structure utilizing spring elements with fins App 20060279932 - Karidis; John P. ;   et al. | 2006-12-14 |
Compliant thermal interface structure utilizing spring elements App 20060279935 - Karidis; John P. ;   et al. | 2006-12-14 |
Cooling structure using rigid movable elements App 20060279936 - Karidis; John P. ;   et al. | 2006-12-14 |
Method and apparatus for correcting for systematic errors in timing pattern generation Grant 7,136,243 - Chainer , et al. November 14, 2 | 2006-11-14 |
Self-servo-writing multi-slot timing pattern Grant 7,019,926 - Chainer , et al. March 28, 2 | 2006-03-28 |
Multi-dimensional compliant thermal cap for an electronic device App 20060060367 - Schultz; Mark D. | 2006-03-23 |
Timing mark position error correction in self-servo write Grant 7,016,140 - Schultz , et al. March 21, 2 | 2006-03-21 |
Method and apparatus for providing combined radial and timing multislot self-servowrite propagation App 20060044667 - Finstad; Blake O. ;   et al. | 2006-03-02 |
Compliant thermal cap for an electronic device App 20060034060 - Schultz; Mark D. | 2006-02-16 |
Liquid cooling structure for electronic device App 20060021747 - Schultz; Mark D. | 2006-02-02 |
Self-servo -writing multi-slot timing pattern App 20050002120 - Chainer, Timothy J. ;   et al. | 2005-01-06 |
Method for storage of self-servowriting timing information Grant 6,735,031 - Chainer , et al. May 11, 2 | 2004-05-11 |
Self-servo-writing multi-slot timing pattern App 20040012874 - Chainer, Timothy J. ;   et al. | 2004-01-22 |
Self-servo-writing timing pattern generation with non-overlapping read and write elements Grant 6,633,451 - Chainer , et al. October 14, 2 | 2003-10-14 |
Rotating media recording system with adaptive track density Grant 6,611,395 - Chainer , et al. August 26, 2 | 2003-08-26 |
Method for self-servowriting timing propagation Grant 6,429,989 - Schultz , et al. August 6, 2 | 2002-08-06 |
Method for storage of self-servowriting timing information App 20020101672 - Chainer, Timothy J. ;   et al. | 2002-08-01 |
Methods and systems for self-servowriting including maintaining a reference level within a usable dynamic range App 20010009484 - Chainer, Timothy J. ;   et al. | 2001-07-26 |
Radial self-propagation pattern generation for disk file servowriting Grant 5,612,833 - Yarmchuk , et al. March 18, 1 | 1997-03-18 |
SEC | 0001449680 | Schultz Mark D |
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