name:-0.2740478515625
name:-0.086679935455322
name:-0.02546501159668
Schultz; Mark D. Patent Filings

Schultz; Mark D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Schultz; Mark D..The latest application filed is for "cold plate with uniform plenum flow".

Company Profile
23.87.88
  • Schultz; Mark D. - Ossining NY
  • Schultz; Mark D. - Ham Lake MN
  • Schultz; Mark D. - Yorktown Heights NY
  • Schultz; Mark D. - Armonk NY US
  • Schultz; Mark D. - Elmsford NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Reduced Pressure Drop Cold Plate Transition
App 20220205740 - Schultz; Mark D.
2022-06-30
Cold Plate With Uniform Plenum Flow
App 20220210946 - Schultz; Mark D. ;   et al.
2022-06-30
Wafer scale supercomputer
Grant 11,335,657 - Colgan , et al. May 17, 2
2022-05-17
Pump drive system
Grant 11,300,112 - Janecek , et al. April 12, 2
2022-04-12
Pattern bonded finned cold plate
Grant 11,278,978 - Schultz March 22, 2
2022-03-22
Wafer Scale Supercomputer
App 20220084969 - Colgan; Evan ;   et al.
2022-03-17
Energy efficiency based control for a cooling system
Grant 11,277,944 - Chainer , et al. March 15, 2
2022-03-15
Module lid with embedded two-phase cooling and insulating layer
Grant 11,201,102 - Parida , et al. December 14, 2
2021-12-14
Compliant pin fin heat sink and methods
Grant 11,158,565 - Karidis , et al. October 26, 2
2021-10-26
Pump Drive System
App 20210301801 - Janecek; Thomas F. ;   et al.
2021-09-30
Burst resistant thin wall heat sink
Grant 11,131,506 - Coteus , et al. September 28, 2
2021-09-28
Large channel interconnects with through silicon Vias (TSVs) and method for constructing the same
Grant 11,127,715 - Andry , et al. September 21, 2
2021-09-21
Data Center Coolant Switch
App 20210243919 - Iyengar; Madhusudan K. ;   et al.
2021-08-05
Data center coolant switch
Grant 11,013,152 - Iyengar , et al. May 18, 2
2021-05-18
Compliant Pin Fin heat sink with base integral pins
Grant 10,991,639 - Schultz April 27, 2
2021-04-27
Pattern Bonded Finned Cold Plate
App 20200400387 - Schultz; Mark D.
2020-12-24
High-density, fail-in-place switches for computer and data networks
Grant 10,749,817 - Coteus , et al. A
2020-08-18
Energy Efficiency Based Control For A Cooling System
App 20200253092 - Kind Code
2020-08-06
Counter-flow expanding channels for enhanced two-phase heat removal
Grant 10,727,159 - Brunschwiler , et al.
2020-07-28
Counter-flow expanding channels for enhanced two-phase heat removal
Grant 10,727,158 - Brunschwiler , et al.
2020-07-28
Mechanically Flexible Cold Plates For Low Power Components
App 20200221610 - Coteus; Paul W. ;   et al.
2020-07-09
Thermal Interface Formed By Condensate
App 20200211924 - Schultz; Mark D. ;   et al.
2020-07-02
Energy efficiency based control for a cooling system
Grant 10,653,044 - Chainer , et al.
2020-05-12
Mechanically flexible cold plates for low power components
Grant 10,631,438 - Coteus , et al.
2020-04-21
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal
App 20200118907 - Brunschwiler; Thomas J. ;   et al.
2020-04-16
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal
App 20200091037 - Brunschwiler; Thomas J. ;   et al.
2020-03-19
Data Center Coolant Switch
App 20200029470 - Iyengar; Madhusudan K. ;   et al.
2020-01-23
Counter-flow expanding channels for enhanced two-phase heat removal
Grant 10,529,648 - Brunschwiler , et al. J
2020-01-07
Module Lid with Embedded Two-Phase Cooling and Insulating Layer
App 20190348345 - Parida; Pritish R. ;   et al.
2019-11-14
Data center coolant switch
Grant 10,440,862 - Iyengar , et al. O
2019-10-08
High-density, fail-in-place switches for computer and data networks
Grant 10,389,654 - Coteus , et al. A
2019-08-20
Two-phase Liquid Cooled Electronics
App 20190230816 - Chainer; Timothy J. ;   et al.
2019-07-25
Data center coolant switch
Grant 10,342,165 - Iyengar , et al.
2019-07-02
Mechanically Flexible Cold Plates For Low Power Components
App 20190200485 - Coteus; Paul W. ;   et al.
2019-06-27
Burst Resistant Thin Wall Heat Sink
App 20190154340 - Coteus; Paul W. ;   et al.
2019-05-23
Large Channel Interconnects With Through Silicon Vias (tsvs) And Method For Constructing The Same
App 20190139938 - Andry; Paul S. ;   et al.
2019-05-09
Cold plate
Grant 10,231,356 - Marroquin , et al.
2019-03-12
Burst resistant thin wall heat sink
Grant 10,222,125 - Coteus , et al.
2019-03-05
Flexible cold plate with enhanced flexibility
Grant 10,215,504 - Coteus , et al. Feb
2019-02-26
High-density, Fail-in-place Switches For Computer And Data Networks
App 20190020597 - Coteus; Paul W. ;   et al.
2019-01-17
Large channel interconnects with through silicon vias (TSVs) and method for constructing the same
Grant 10,177,116 - Andry , et al. J
2019-01-08
Pin fin compliant heat sink with enhanced flexibility
Grant 10,168,108 - Schultz J
2019-01-01
Compliant Pin Fin Heat Sink And Methods
App 20180240735 - Karidis; John P. ;   et al.
2018-08-23
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal
App 20180182686 - Brunschwiler; Thomas J. ;   et al.
2018-06-28
Pin Fin Compliant Heat Sink With Enhanced Flexibility
App 20180164048 - Schultz; Mark D.
2018-06-14
Compliant pin fin heat sink and methods
Grant 9,997,435 - Karidis , et al. June 12, 2
2018-06-12
Cold Plate
App 20180124949 - MARROQUIN; Christopher M. ;   et al.
2018-05-03
Pin fin compliant heat sink with enhanced flexibility
Grant 9,939,210 - Schultz April 10, 2
2018-04-10
Counter-flow expanding channels for enhanced two-phase heat removal
Grant 9,941,189 - Brunschwiler , et al. April 10, 2
2018-04-10
Near-chip compliant layer for reducing perimeter stress during assembly process
Grant 9,922,900 - Schultz , et al. March 20, 2
2018-03-20
Cold plate
Grant 9,894,801 - Marroquin , et al. February 13, 2
2018-02-13
Interlayer chip cooling apparatus
Grant 9,875,953 - Chainer , et al. January 23, 2
2018-01-23
Heat sink for semiconductor modules
Grant 9,831,151 - Schultz November 28, 2
2017-11-28
Compliant Pin Fin Heat Sink With Base Integral Pins
App 20170287809 - SCHULTZ; Mark D.
2017-10-05
Compliant Pin Fin Heat Sink And Methods
App 20170236770 - KARIDIS; JOHN P. ;   et al.
2017-08-17
Calibrating thermal behavior of electronics
Grant 9,702,767 - Chainer , et al. July 11, 2
2017-07-11
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal
App 20170179001 - Brunschwiler; Thomas J. ;   et al.
2017-06-22
Near-chip Compliant Layer For Reducing Perimeter Stress During Assembly Process
App 20170170092 - Schultz; Mark D. ;   et al.
2017-06-15
Thermal management of optical coupling systems
Grant 9,678,289 - Schultz , et al. June 13, 2
2017-06-13
Thermal Management Of Optical Coupling Systems
App 20170160501 - Schultz; Mark D. ;   et al.
2017-06-08
High-density, Fail-in-place Switches For Computer And Data Networks
App 20170155598 - Coteus; Paul W. ;   et al.
2017-06-01
High-density, fail-in-place switches for computer and data networks
Grant 9,634,959 - Coteus , et al. April 25, 2
2017-04-25
Calibrating Thermal Behavior Of Electronics
App 20170102273 - Chainer; Timothy J. ;   et al.
2017-04-13
Near-chip compliant layer for reducing perimeter stress during assembly process
Grant 9,570,373 - Schultz , et al. February 14, 2
2017-02-14
Calibrating thermal behavior of electronics
Grant 9,534,967 - Chainer , et al. January 3, 2
2017-01-03
Flexible Cold Plate With Enhanced Flexibility
App 20160290728 - Coteus; Paul W. ;   et al.
2016-10-06
Burst Resistant Thin Wall Heat Sink
App 20160290727 - Coteus; Paul W. ;   et al.
2016-10-06
Calibrating Thermal Behavior Of Electronics
App 20160252408 - Chainer; Timothy J. ;   et al.
2016-09-01
Compliant pin fin heat sink and methods
Grant 9,425,124 - Karidis , et al. August 23, 2
2016-08-23
Cooling apparatus with a resilient heat conducting member
Grant 9,370,122 - Chainer , et al. June 14, 2
2016-06-14
Calibrating thermal behavior of electronics
Grant 9,354,126 - Chainer , et al. May 31, 2
2016-05-31
Interlayer Chip Cooling Apparatus
App 20160128232 - Chainer; Timothy J. ;   et al.
2016-05-05
Pin Fin Compliant Heat Sink With Enhanced Flexibility
App 20160091260 - Schultz; Mark D.
2016-03-31
Data Center Coolant Switch
App 20160021795 - Iyengar; Madhusudan K. ;   et al.
2016-01-21
Data Center Coolant Switch
App 20160021794 - Iyengar; Madhusudan K. ;   et al.
2016-01-21
Information technology equipment cooling method
Grant 9,167,728 - Schultz October 20, 2
2015-10-20
High-density, Fail-in-place Switches For Computer And Data Networks
App 20150289406 - Coteus; Paul W. ;   et al.
2015-10-08
Data center coolant switch
Grant 9,151,543 - Iyengar , et al. October 6, 2
2015-10-06
Data center cooling method
Grant 9,107,327 - Chainer , et al. August 11, 2
2015-08-11
Large Channel Interconnects With Through Silicon Vias (tsvs) And Method For Constructing The Same
App 20150221613 - Andry; Paul S. ;   et al.
2015-08-06
Dynamically limiting energy consumed by cooling apparatus
Grant 9,052,722 - Chainer , et al. June 9, 2
2015-06-09
Dynamically limiting energy consumed by cooling apparatus
Grant 9,043,035 - Chainer , et al. May 26, 2
2015-05-26
Data center cooling system
Grant 8,978,401 - Chainer , et al. March 17, 2
2015-03-17
Cooling Apparatus With A Resilient Heat Conducting Member
App 20140192476 - Chainer; Timothy J. ;   et al.
2014-07-10
Energy Efficiency Based Control For A Cooling System
App 20140190681 - Chainer; Timothy J. ;   et al.
2014-07-10
Probe apparatus assembly and method
Grant 8,760,186 - Schultz June 24, 2
2014-06-24
Information technology equipment cooling system
Grant 8,746,000 - Schultz June 10, 2
2014-06-10
Calibrating Thermal Behavior Of Electronics
App 20140153607 - Chainer; Timothy J. ;   et al.
2014-06-05
Flexible heat sink with lateral compliance
Grant 8,736,048 - Schultz May 27, 2
2014-05-27
Method of fabricating a cooled electronic system
Grant 8,649,177 - Chainer , et al. February 11, 2
2014-02-11
Data Center Cooling Method
App 20140020885 - Chainer; Timothy J. ;   et al.
2014-01-23
Data Center Cooling System
App 20140020418 - Chainer; Timothy J. ;   et al.
2014-01-23
Information Technology Equipment Cooling Method
App 20140020884 - Schultz; Mark D.
2014-01-23
Information Technology Equipment Cooling System
App 20140022725 - Schultz; Mark D.
2014-01-23
Flexible Heat Sink With Lateral Compliance
App 20130214406 - Schultz; Mark D.
2013-08-22
Compliant Pin Fin Heat Sink And Methods
App 20130199767 - Karidis; John P. ;   et al.
2013-08-08
Cooled electronic system with thermal spreaders coupling electronics cards to cold rails
Grant 8,493,738 - Chainer , et al. July 23, 2
2013-07-23
Dynamically Limiting Energy Consumed By Cooling Apparatus
App 20130138252 - CHAINER; Timothy J. ;   et al.
2013-05-30
Dynamically Limiting Energy Consumed By Cooling Apparatus
App 20130138253 - CHAINER; Timothy J. ;   et al.
2013-05-30
Data Center Coolant Switch
App 20130014926 - Iyengar; Madhusudan K. ;   et al.
2013-01-17
Method Of Fabricating A Cooled Electronic System
App 20120279047 - CHAINER; Timothy J. ;   et al.
2012-11-08
Cooled Electronic System With Thermal Spreaders Coupling Electronics Cards To Cold Rails
App 20120281358 - CHAINER; Timothy J. ;   et al.
2012-11-08
Method of full-field solder coverage by inverting a fill head and a mold
Grant 8,286,855 - Budd , et al. October 16, 2
2012-10-16
Method Of Full-field Solder Coverage
App 20120193833 - BUDD; Russell A. ;   et al.
2012-08-02
Method of full-field solder coverage using a vacuum fill head
Grant 8,181,846 - Budd , et al. May 22, 2
2012-05-22
Probe Apparatus Assembly And Method
App 20110203108 - Schultz; Mark D.
2011-08-25
Fill-head For Full-field Solder Coverage With A Rotatable Member
App 20110203762 - BUDD; Russell A. ;   et al.
2011-08-25
Fill head for full-field solder coverage with a rotatable member
Grant 7,980,445 - Budd , et al. July 19, 2
2011-07-19
Reduced friction molds for injection molded solder processing
Grant 7,931,249 - Schultz April 26, 2
2011-04-26
Step-down Transition Of A Solder Head In The Injection Molding Soldering Process
App 20100252225 - Schultz; Mark D.
2010-10-07
Method for step-down transition of a solder head in the injection molding soldering process
Grant 7,757,932 - Schultz July 20, 2
2010-07-20
Management of data cartridges in multiple-cartridge cells in an automated data storage library
Grant 7,751,141 - Chamorro , et al. July 6, 2
2010-07-06
Full-field Solder Coverage
App 20090183849 - Budd; Russell A. ;   et al.
2009-07-23
High Performance Compliant Thermal Interface Cooling Structures
App 20090151893 - Karidis; John P. ;   et al.
2009-06-18
Compliant Thermal Interface Design And Assembly Method
App 20090151907 - Karidis; John P. ;   et al.
2009-06-18
Management Of Data Cartridges In Multiple-cartridge Cells In An Automated Data Storage Library
App 20090147394 - Chamorro; German A. ;   et al.
2009-06-11
Cooling structure using rigid movable elements
Grant 7,545,648 - Karidis , et al. June 9, 2
2009-06-09
Compliant thermal interface structure utilizing spring elements
Grant 7,545,647 - Karidis , et al. June 9, 2
2009-06-09
Data storage cartridge gripper with deep-reach
Grant 7,518,822 - Karidis , et al. April 14, 2
2009-04-14
Management of data cartridges in multiple-cartridge cells in an automated data storage library
Grant 7,505,224 - Chamorro , et al. March 17, 2
2009-03-17
Cooling An Electronic Device Utilizing Spring Elements With Fins
App 20080298016 - Karidis; John P. ;   et al.
2008-12-04
Method And Apparatus For Increasing Visibility Of A Laser Pointer
App 20080247165 - Schultz; Mark D.
2008-10-09
Reduced Friction Molds For Injection Molded Solder Processing
App 20080185118 - Schultz; Mark D.
2008-08-07
Compliant thermal interface structure utilizing spring elements with fins
Grant 7,408,780 - Karidis , et al. August 5, 2
2008-08-05
Cooling Structure Using Rigid Movable Elements
App 20080170370 - Karidis; John P. ;   et al.
2008-07-17
Virtual Pointer
App 20080170033 - Schultz; Mark D.
2008-07-17
Compliant Thermal Interface Structure Utilizing Spring Elements
App 20080144288 - Karidis; John P. ;   et al.
2008-06-19
Cooling structure using rigid movable elements
Grant 7,362,582 - Karidis , et al. April 22, 2
2008-04-22
Compliant thermal interface structure utilizing spring elements
Grant 7,355,855 - Karidis , et al. April 8, 2
2008-04-08
Method for step-down transition of a solder head in the injection molding soldering process
App 20080048008 - Schultz; Mark D.
2008-02-28
Compliant thermal cap for an electronic device
Grant 7,304,849 - Schultz December 4, 2
2007-12-04
Multidimensional Compliant Thermal Cap for an Electronic Device
App 20070272425 - Schultz; Mark D.
2007-11-29
Management of data cartridges in multiple-cartridge cells in an automated data storage library
App 20070211366 - Chamorro; German A. ;   et al.
2007-09-13
Self-servo-writing multi-slot timing pattern
Grant 7,268,963 - Chainer , et al. September 11, 2
2007-09-11
Multi-dimensional compliant thermal cap for an electronic device
Grant 7,268,292 - Schultz September 11, 2
2007-09-11
Method and apparatus for providing combined radial and timing multislot self-servowrite propagation
Grant 7,236,323 - Finstad , et al. June 26, 2
2007-06-26
Liquid cooling structure for electronic device
Grant 7,188,667 - Schultz March 13, 2
2007-03-13
Compliant thermal interface structure utilizing spring elements with fins
App 20060279932 - Karidis; John P. ;   et al.
2006-12-14
Compliant thermal interface structure utilizing spring elements
App 20060279935 - Karidis; John P. ;   et al.
2006-12-14
Cooling structure using rigid movable elements
App 20060279936 - Karidis; John P. ;   et al.
2006-12-14
Method and apparatus for correcting for systematic errors in timing pattern generation
Grant 7,136,243 - Chainer , et al. November 14, 2
2006-11-14
Self-servo-writing multi-slot timing pattern
Grant 7,019,926 - Chainer , et al. March 28, 2
2006-03-28
Multi-dimensional compliant thermal cap for an electronic device
App 20060060367 - Schultz; Mark D.
2006-03-23
Timing mark position error correction in self-servo write
Grant 7,016,140 - Schultz , et al. March 21, 2
2006-03-21
Method and apparatus for providing combined radial and timing multislot self-servowrite propagation
App 20060044667 - Finstad; Blake O. ;   et al.
2006-03-02
Compliant thermal cap for an electronic device
App 20060034060 - Schultz; Mark D.
2006-02-16
Liquid cooling structure for electronic device
App 20060021747 - Schultz; Mark D.
2006-02-02
Self-servo -writing multi-slot timing pattern
App 20050002120 - Chainer, Timothy J. ;   et al.
2005-01-06
Method for storage of self-servowriting timing information
Grant 6,735,031 - Chainer , et al. May 11, 2
2004-05-11
Self-servo-writing multi-slot timing pattern
App 20040012874 - Chainer, Timothy J. ;   et al.
2004-01-22
Self-servo-writing timing pattern generation with non-overlapping read and write elements
Grant 6,633,451 - Chainer , et al. October 14, 2
2003-10-14
Rotating media recording system with adaptive track density
Grant 6,611,395 - Chainer , et al. August 26, 2
2003-08-26
Method for self-servowriting timing propagation
Grant 6,429,989 - Schultz , et al. August 6, 2
2002-08-06
Method for storage of self-servowriting timing information
App 20020101672 - Chainer, Timothy J. ;   et al.
2002-08-01
Methods and systems for self-servowriting including maintaining a reference level within a usable dynamic range
App 20010009484 - Chainer, Timothy J. ;   et al.
2001-07-26
Radial self-propagation pattern generation for disk file servowriting
Grant 5,612,833 - Yarmchuk , et al. March 18, 1
1997-03-18
Company Registrations
SEC0001449680Schultz Mark D

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