Schultz; Laurence D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Schultz; Laurence D..The latest application filed is for "versatile system for conditioning slurry in cmp process".

Company Profile

0.13.4

Schultz; Laurence D. - Richardson TX
Schultz; Laurence D. - Kissimmee FL
Schultz; Laurence D. - Orlando FL
Schultz; Laurence D. - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Versatile system for conditioning slurry in CMP process Grant 7,695,589 - Stark , et al. April 13, 2	2010-04-13
Versatile System For Conditioning Slurry In Cmp Process App 20060276042 - Stark; David A. ; et al.	2006-12-07
Versatile system for conditioning slurry in CMP process App 20060026906 - Stark; David A. ; et al.	2006-02-09
Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof Grant 6,702,654 - Nanda , et al. March 9, 2	2004-03-09
Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof App 20020106979 - Nanda, Arun K. ; et al.	2002-08-08
Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof App 20020106829 - Nanda, Arun K. ; et al.	2002-08-08
Method of planarizing a surface on a semiconductor wafer Grant 6,083,838 - Burton , et al. July 4, 2	2000-07-04
Polishing apparatus with carrier head pivoting device Grant 6,056,630 - Nanda , et al. May 2, 2	2000-05-02
Under-pad for chemical-mechanical planarization of semiconductor wafers Grant 5,871,392 - Meikle , et al. February 16, 1	1999-02-16
Method for chemical planarization (CMP) of a semiconductor wafer to provide a planar surface free of microscratches Grant 5,514,245 - Doan , et al. May 7, 1	1996-05-07
Apparatus for planarizing semiconductor wafers, and a polishing pad for a planarization apparatus Grant 5,421,769 - Schultz , et al. June 6, 1	1995-06-06
Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer Grant RE34,425 - Schultz November 2, 1	1993-11-02
Method for planarizing semiconductor wafers with a non-circular polishing pad Grant 5,234,867 - Schultz , et al. August 10, 1	1993-08-10
Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer Grant 5,081,796 - Schultz January 21, 1	1992-01-21
Apparatus for endpoint detection during mechanical planarization of semiconductor wafers Grant 5,069,002 - Sandhu , et al. December 3, 1	1991-12-03
Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers Grant 5,036,015 - Sandhu , et al. July 30, 1	1991-07-30
Method of reworking an electrical multilayer interconnect Grant 5,011,580 - Pan , et al. April 30, 1	1991-04-30

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