Schuckman; Amanda E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Schuckman; Amanda E..The latest application filed is for "high density organic interconnect structures".

Company Profile

12.18.22

Schuckman; Amanda E. - Chandler AZ
SCHUCKMAN; Amanda E. - Scottsdale AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High Density Organic Interconnect Structures App 20220059367 - Chavali; Sri Chaitra Jyotsna ; et al.	2022-02-24
Bridge Interconnection With Layered Interconnect Structures App 20210384129 - LIU; Yueli ; et al.	2021-12-09
High density organic interconnect structures Grant 11,195,727 - Chavali , et al. December 7, 2	2021-12-07
Bridge interconnection with layered interconnect structures Grant 11,133,257 - Liu , et al. September 28, 2	2021-09-28
Semiconductor device including silane based adhesion promoter and method of making Grant 10,916,486 - Brown , et al. February 9, 2	2021-02-09
Electronic assembly that includes void free holes Grant 10,856,424 - Boyapati , et al. December 1, 2	2020-12-01
High density organic interconnect structures Grant 10,685,850 - Chavali , et al.	2020-06-16
Bridge Interconnection With Layered Interconnect Structures App 20200043852 - Liu; Yueli ; et al.	2020-02-06
Systems and methods for semiconductor packages using photoimageable layers Grant 10,553,453 - Chavali , et al. Fe	2020-02-04
Semiconductor Device And Method Of Making App 20190355642 - Brown; Andrew J. ; et al.	2019-11-21
Bridge interconnection with layered interconnect structures Grant 10,475,745 - Liu , et al. Nov	2019-11-12
Systems And Methods For Semiconductor Packages Using Photoimageable Layers App 20190311916 - CHAVALI; Sri Chaitra ; et al.	2019-10-10
Nickel-tin Microbump Structures And Method Of Making Same App 20190244922 - JAIN; Rahul ; et al.	2019-08-08
Tin-zinc microbump structures and method of making same Grant 10,373,900 - Chavali , et al.	2019-08-06
High Density Organic Interconnect Structures App 20190221447 - Chavali; Sri Chaitra Jyotsna ; et al.	2019-07-18
Copper seed layer and nickel-tin microbump structures Grant 10,297,563 - Jain , et al.	2019-05-21
Bridge Interconnection With Layered Interconnect Structures App 20190013271 - Liu; Yueli ; et al.	2019-01-10
Redundant Through-hole Interconnect Structures App 20180323138 - SCHUCKMAN; Amanda E. ; et al.	2018-11-08
Bridge interconnection with layered interconnect structures Grant 10,103,103 - Liu , et al. October 16, 2	2018-10-16
Electronic Assembly That Includes Void Free Holes App 20180288885 - Boyapati; Sri Ranga Sai ; et al.	2018-10-04
Metal protected fan-out cavity Grant 9,953,959 - Darmawikarta , et al. April 24, 2	2018-04-24
Nickel-tin Microbump Structures And Method Of Making Same App 20180076161 - Jain; Rahul ; et al.	2018-03-15
Tin-zinc Microbump Structures And Method Of Making Same App 20180076119 - Chavali; Sri Chaitra J. ; et al.	2018-03-15
Package with bi-layered dielectric structure Grant 9,917,044 - Zhou , et al. March 13, 2	2018-03-13
Tin-zinc microbump structures Grant 9,837,341 - Chavali , et al. December 5, 2	2017-12-05
Desmear with metalized protective film Grant 9,741,606 - Zhou , et al. August 22, 2	2017-08-22
Bridge Interconnection With Layered Interconnect Structures App 20170207168 - Liu; Yueli ; et al.	2017-07-20
Stress Tolerant Composite Material And Architecture App 20170174894 - Chavali; Sri Chaitra ; et al.	2017-06-22
Bridge interconnection with layered interconnect structures Grant 9,640,485 - Liu , et al. May 2, 2	2017-05-02
Package With Bi-layered Dielectric Structure App 20170103941 - Zhou; Zheng ; et al.	2017-04-13
Desmear With Metalized Protective Film App 20170040211 - Zhou; Zheng ; et al.	2017-02-09
Bridge Interconnection With Layered Interconnect Structures App 20150364423 - Liu; Yueli ; et al.	2015-12-17
Bridge interconnection with layered interconnect structures Grant 9,147,663 - Liu , et al. September 29, 2	2015-09-29
Bridge Interconnection With Layered Interconnect Structures App 20140353827 - Liu; Yueli ; et al.	2014-12-04
Providing A Void-free Filled Interconnect Structure In A Layer Of A Package Substrate App 20140332974 - Schuckman; Amanda E. ; et al.	2014-11-13
Providing a void-free filled interconnect structure in a layer of package substrate Grant 8,877,632 - Schuckman , et al. November 4, 2	2014-11-04

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