Schroeder; Jack A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Schroeder; Jack A..The latest application filed is for "structure having flip-chip connected substrates".
- Schroeder; Jack A. - Scottsdale AZ
- Schroeder; Jack A. - Austin TX
| Patent | Date |
|---|---|
| Structure having flip-chip connected substrates Grant 5,742,100 - Schroeder , et al. April 21, 1 | 1998-04-21 |
| Multifunction ground plane Grant 4,933,741 - Schroeder June 12, 1 | 1990-06-12 |
| Interconnect and cooling system for a semiconductor device Grant 4,933,747 - Schroeder June 12, 1 | 1990-06-12 |
| Flip chip module Grant 4,805,007 - Schroeder February 14, 1 | 1989-02-14 |
| Method of making a high density IC module assembly Grant 4,722,914 - Drye , et al. February 2, 1 | 1988-02-02 |
| High density IC module assembly Grant 4,630,096 - Drye , et al. December 16, 1 | 1986-12-16 |
| Metallization and bonding means and method for VLSI packages Grant 4,513,355 - Schroeder , et al. April 23, 1 | 1985-04-23 |
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