Schrock; Tony
Patent Applications and Registrations
Patent applications and USPTO patent grants for Schrock; Tony.The latest application filed is for "method to reduce charge buildup during high aspect ratio contact etch".
- Schrock; Tony - Boise ID US
| Patent | Date |
|---|---|
| Method to reduce charge buildup during high aspect ratio contact etch Grant 8,673,787 - Sandhu , et al. March 18, 2 | 2014-03-18 |
| Method to Reduce Charge Buildup During High Aspect Ratio Contact Etch App 20110250759 - Sandhu; Gurtej S. ; et al. | 2011-10-13 |
| Method to reduce charge buildup during high aspect ratio contact etch Grant 7,985,692 - Sandhu , et al. July 26, 2 | 2011-07-26 |
| Methods of etching features into substrates Grant 7,857,982 - Abatchev , et al. December 28, 2 | 2010-12-28 |
| Method To Reduce Charge Buildup During High Aspect Ratio Contact Etch App 20080128389 - Sandhu; Gurtej S. ; et al. | 2008-06-05 |
| Method to reduce charge buildup during high aspect ratio contact etch Grant 7,344,975 - Sandhu , et al. March 18, 2 | 2008-03-18 |
| Method to reduce charge buildup during high aspect ratio contact etch App 20070049018 - Sandhu; Gurtej S. ; et al. | 2007-03-01 |
| Methods of etching features into substrates App 20070020936 - Abatchev; Mirzafer ; et al. | 2007-01-25 |
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