Schrock; Edward A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Schrock; Edward A..The latest application filed is for "methods for fabricating chip-scale packages having carrier bonds".
- Schrock; Edward A. - Boise ID
| Patent | Date |
|---|---|
| Methods for fabricating chip-scale packages having carrier bonds App 20070166882 - Jiang; Tongbi ; et al. | 2007-07-19 |
| Method for forming stencil Grant 7,213,331 - Jiang , et al. May 8, 2 | 2007-05-08 |
| Method for attaching a semiconductor die to a substrate Grant 6,770,164 - Schrock , et al. August 3, 2 | 2004-08-03 |
| Z-axis electrical contact for microelectronic devices App 20040078967 - Jiang, Tongbi ; et al. | 2004-04-29 |
| Methods for use in packaging applications using an adhesive composition Grant 6,709,896 - Cobbley , et al. March 23, 2 | 2004-03-23 |
| Semiconductor device, electrical conductor system, and method of making Grant 6,707,152 - Schrock March 16, 2 | 2004-03-16 |
| Adhesive composition for use in packaging applications Grant 6,699,928 - Cobbley , et al. March 2, 2 | 2004-03-02 |
| Z-axis electrical contact for microelectric devices Grant 6,662,440 - Jiang , et al. December 16, 2 | 2003-12-16 |
| Adhesive composition and methods for use in packaging applications Grant 6,646,354 - Cobbley , et al. November 11, 2 | 2003-11-11 |
| Z-axis electrical contact for microelectronic devices Grant 6,616,864 - Jiang , et al. September 9, 2 | 2003-09-09 |
| Adhesive Composition For Use In Packaging Applications App 20030122226 - COBBLEY, CHAD A. ; et al. | 2003-07-03 |
| Multi-layered adhesive for attaching a semiconductor die to a substrate Grant 6,541,872 - Schrock , et al. April 1, 2 | 2003-04-01 |
| Controlling packaging encapsulant leakage Grant 6,521,980 - Tandy , et al. February 18, 2 | 2003-02-18 |
| Method Of Fabricating Chip-Scale Packages And Resulting Structures App 20020125568 - Jiang, Tongbi ; et al. | 2002-09-12 |
| Adhesive composition for use in packaging applications App 20020068379 - Cobbley, Chad A. ; et al. | 2002-06-06 |
| Controlling packaging encapsulant leakage Grant 6,395,579 - Tandy , et al. May 28, 2 | 2002-05-28 |
| Controlling packaging encapsulant leakage App 20010008780 - Tandy, Patrick W. ; et al. | 2001-07-19 |
| Controlling packaging encapsulant leakage Grant 6,210,992 - Tandy , et al. April 3, 2 | 2001-04-03 |
| Method and apparatus for verifying the presence or absence of a component Grant 5,962,862 - Evers , et al. October 5, 1 | 1999-10-05 |
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