Schrock; Edward
Patent Applications and Registrations
Patent applications and USPTO patent grants for Schrock; Edward.The latest application filed is for "composite interposer for bga packages".
- Schrock; Edward - Boise ID
| Patent | Date |
|---|---|
| Method of making a flexible substrate with a filler material Grant 7,071,030 - Jiang , et al. July 4, 2 | 2006-07-04 |
| BGA package having substrate with patterned solder mask defining open die attach area Grant 6,825,569 - Jiang , et al. November 30, 2 | 2004-11-30 |
| Composite interposer for BGA packages Grant 6,770,981 - Jiang , et al. August 3, 2 | 2004-08-03 |
| Composite interposer for BGA packages Grant 6,710,456 - Jiang , et al. March 23, 2 | 2004-03-23 |
| Composite interposer for BGA packages App 20030164556 - Jiang, Tongbi ; et al. | 2003-09-04 |
| Method of making a flexible substrate with a filler material App 20030153099 - Jiang, Tongbi ; et al. | 2003-08-14 |
| BGA Package Having Substrate With Patterned Solder Mask Defining Open Die Attach Area App 20010013642 - JIANG, TONGBI ; et al. | 2001-08-16 |
| Method for fabricating BGA package using substrate with patterned solder mask open in die attach area Grant 6,048,755 - Jiang , et al. April 11, 2 | 2000-04-11 |
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