Schrapler; Lutz
Patent Applications and Registrations
Patent applications and USPTO patent grants for Schrapler; Lutz.The latest application filed is for "copper bonding or superfine wire with improved bonding and corrosion properties".
- Schrapler; Lutz - Karlstein DE
- Schrapler; Lutz - Alzenau DE
| Patent | Date |
|---|---|
| Copper bonding or superfine wire with improved bonding and corrosion properties Grant 7,645,522 - Bischoff , et al. January 12, 2 | 2010-01-12 |
| Fine wire of gold alloy, method for manufacture thereof and use thereof Grant 6,103,025 - Herklotz , et al. August 15, 2 | 2000-08-15 |
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