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Patent applications and USPTO patent grants for Schoonejongen; Ronald J..The latest application filed is for "method for molding semiconductor package having a ceramic substrate".
Patent | Date |
---|---|
Method for molding semiconductor package having a ceramic substrate Grant 6,534,338 - Schoonejongen , et al. March 18, 2 | 2003-03-18 |
Solderable conductor Grant 4,564,563 - Martin , et al. January 14, 1 | 1986-01-14 |
Fast curing solderable conductor Grant 4,535,012 - Martin , et al. August 13, 1 | 1985-08-13 |
Thick film conductors for use in microelectronic packaging Grant 4,350,618 - Hilson , et al. September 21, 1 | 1982-09-21 |
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