Schonauer; Diana M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Schonauer; Diana M..The latest application filed is for "prevention of precipitation defects on copper interconnects during cpm by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties".

Company Profile

0.10.2

Schonauer; Diana M. - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties Grant 6,720,264 - Sahota , et al. April 13, 2	2004-04-13
Prevention Of Precipitation Defects On Copper Interconnects During Cpm By Use Of Solutions Containing Organic Compounds With Silica Adsorption And Copper Corrosion Inhibiting Properties App 20040014319 - Sahota, Kashmir S. ; et al.	2004-01-22
Chemically preventing Cu dendrite formation and growth by immersion Grant 6,596,637 - Schonauer , et al. July 22, 2	2003-07-22
Ta barrier slurry containing an organic additive Grant 6,503,418 - Sahota , et al. January 7, 2	2003-01-07
Ta Barrier Slurry Containing An Organic Additive App 20020005504 - SAHOTA, KASHMIR S. ; et al.	2002-01-17
Chemically preventing copper dendrite formation and growth by spraying Grant 6,319,833 - Schonauer , et al. November 20, 2	2001-11-20
Chemically preventing Cu dendrite formation and growth by double sided scrubbing Grant 6,197,690 - Schonauer , et al. March 6, 2	2001-03-06
Chemically removable Cu CMP slurry abrasive Grant 6,169,034 - Avanzino , et al. January 2, 2	2001-01-02
Chemically removable Cu CMP slurry abrasive Grant 6,140,239 - Avanzino , et al. October 31, 2	2000-10-31
Method of preventing copper dendrite formation and growth Grant 6,074,949 - Schonauer , et al. June 13, 2	2000-06-13
Reduced chemical-mechanical polishing particulate contamination Grant 5,702,563 - Salugsugan , et al. December 30, 1	1997-12-30
Chemical solutions for removing metal-compound contaminants from wafers after CMP and the method of wafer cleaning Grant 5,662,769 - Schonauer , et al. September 2, 1	1997-09-02

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