Scholz; Wolfgang A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Scholz; Wolfgang A..The latest application filed is for "multi-chip module (mcm) of a computer system".

Company Profile

0.5.6

Scholz; Wolfgang A. - Starzach N/A DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Gel package structural enhancement of compression system board connections Grant 8,929,086 - McAllister , et al. January 6, 2	2015-01-06
Method for structural enhancement of compression system board connections Grant 7,930,820 - McAllister , et al. April 26, 2	2011-04-26
Gel package structural enhancement of compression system board connections Grant 7,543,373 - McAllister , et al. June 9, 2	2009-06-09
Multi-Chip Module (MCM) of a Computer System App 20080089024 - McAllister; Michael F. ; et al.	2008-04-17
Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener Grant 7,344,919 - McAllister , et al. March 18, 2	2008-03-18
Gel package structural enhancement of compression system board connections App 20070069358 - McAllister; Michael F. ; et al.	2007-03-29
Gel package structural enhancement of compression system board connections App 20070069753 - McAllister; Michael F. ; et al.	2007-03-29
Gel package structural enhancement of compression system board connections App 20070072344 - McAllister; Michael F. ; et al.	2007-03-29
Gel package structural enhancement of compression system board connections App 20070072450 - McAllister; Michael F. ; et al.	2007-03-29
Gel package structural enhancement of compression system board connections App 20070069754 - McAllister; Michael F. ; et al.	2007-03-29

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