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Patent applications and USPTO patent grants for Schofield; Hazel D..The latest application filed is for "contact pad structure for flip chip semiconductor die".
Patent | Date |
---|---|
Contact pad structure for flip chip semiconductor die Grant 7,821,133 - Schofield , et al. October 26, 2 | 2010-10-26 |
Semiconductor device packages with substrates for redistributing semiconductor device electrodes Grant 7,745,930 - Connah , et al. June 29, 2 | 2010-06-29 |
Contact pad structure for flip chip semiconductor die App 20070096316 - Schofield; Hazel D. ;   et al. | 2007-05-03 |
Semiconductor device packages with substrates for redistributing semiconductor device electrodes App 20060261473 - Connah; Norman Glyn ;   et al. | 2006-11-23 |
Chip scale surface mounted device and process of manufacture Grant 7,122,887 - Standing , et al. October 17, 2 | 2006-10-17 |
Chip scale surface mounted device and process of manufacture App 20010048116 - Standing, Martin ;   et al. | 2001-12-06 |
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