Schober; Joachim Heinz

Patent Applications and Registrations

Patent applications and USPTO patent grants for Schober; Joachim Heinz.The latest application filed is for "microelectronic package assembly, method for disconnecting a microelectronic package".

Company Profile

0.10.8

Schober; Joachim Heinz - Graz N/A AT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor chip, transponder and method of manufacturing a transponder Grant 9,047,548 - Scherabon , et al. June 2, 2	2015-06-02
Chip card for insertion into a holder Grant 8,695,881 - Schober , et al. April 15, 2	2014-04-15
Microelectronic package assembly, method for disconnecting a microelectronic package Grant 8,659,132 - Schober February 25, 2	2014-02-25
Microelectronic Package Assembly, Method For Disconnecting A Microelectronic Package App 20110204503 - Schober; Joachim Heinz	2011-08-25
Semiconductor Chip, Transponder and Method of Manufacturing a Transponder App 20100224959 - Scherabon; Christian ; et al.	2010-09-09
Chip card for insertion into a holder App 20090200381 - Schober; Joachim Heinz ; et al.	2009-08-13
Lead-frame configuration for chips Grant 7,245,005 - Moll , et al. July 17, 2	2007-07-17
Product comprising product sub-parts connected to each other by a crimp connection Grant 7,124,956 - Moll , et al. October 24, 2	2006-10-24
Lead-frame configuration for chips App 20040174690 - Moll, Rainer ; et al.	2004-09-09
Product comprising product sub-parts connected to each other by a crimp connection App 20040144848 - Moll, Rainer ; et al.	2004-07-29
Product comprising a substrate and a chip attached to the substrate App 20040140122 - Moll, Rainer ; et al.	2004-07-22
Data carrier having an IC module with a protection mechanism for protecting the parts of the IC module from mechanical stress Grant 6,657,294 - Toth , et al. December 2, 2	2003-12-02
Module having a lead frame equipped with components on both sides Grant 6,643,142 - Aflenzer , et al. November 4, 2	2003-11-04
Module having a lead frame equipped with components on both sides App 20020075663 - Aflenzer, Gunter ; et al.	2002-06-20
Data carrier having an IC module with a protection means for protecting the parts of the IC module in the case of bending or twisting thereof App 20020020900 - Toth, Marcus ; et al.	2002-02-21

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.