Schneider; Donald E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Schneider; Donald E..The latest application filed is for "resilient flooring structure with encapsulated fabric".

Company Profile

0.7.3

Schneider; Donald E. - Kirkland WA US
Schneider; Donald E. - Lititz PA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Presenting information related to content items Grant 9,372,592 - Goodspeed , et al. June 21, 2	2016-06-21
Hot melt calendered or extruded wear layer for embossed substrates Grant 7,378,143 - Schneider , et al. May 27, 2	2008-05-27
Resilient flooring structure with encapsulated fabric App 20050090167 - Hynicka, Steven F. ; et al.	2005-04-28
Resilient flooring structure with encapsulated fabric Grant 6,818,282 - Hynicka , et al. November 16, 2	2004-11-16
Hot melt calendered or extruded wear layer for embossed substrates and method of manufacture App 20040048044 - Schneider, Donald E. ; et al.	2004-03-11
Resilient flooring structure with encapsulated fabric App 20030215618 - Hynicka, Steven F. ; et al.	2003-11-20
Hot melt calendered or extruded wear layer for embossed substrates and method of manufacture Grant 6,649,248 - Schneider , et al. November 18, 2	2003-11-18
Hot melt calendered or extruded wear layer for embossed substrates and method of manufacture Grant 6,444,075 - Schneider , et al. September 3, 2	2002-09-03
Process for producing decorative multi-level embossed surface covering Grant 4,158,073 - Schneider , et al. June 12, 1	1979-06-12

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