Schmitt; Francimar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Schmitt; Francimar.The latest application filed is for "mixed silicon phase film for high efficiency thin film silicon solar cells".

Company Profile

0.8.15

Schmitt; Francimar - Santa Clara CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Elimination of first wafer effect for PECVD films Grant 9,157,151 - Lakshmanan , et al. October 13, 2	2015-10-13
Mixed Silicon Phase Film For High Efficiency Thin Film Silicon Solar Cells App 20110114177 - Yang; Fan ; et al.	2011-05-19
Multi-stage curing of low K nano-porous films Grant 7,611,996 - Schmitt , et al. November 3, 2	2009-11-03
Techniques promoting adhesion of porous low K film to underlying barrier layer Grant 7,547,643 - Schmitt , et al. June 16, 2	2009-06-16
Low temperature process to produce low-K dielectrics with low stress by plasma-enhanced chemical vapor deposition (PECVD) Grant 7,422,776 - Yim , et al. September 9, 2	2008-09-09
Uv Curing Of Pecvd-deposited Sacrificial Polymer Films For Air-gap Ild App 20080182403 - NOORI; ATIF ; et al.	2008-07-31
Method For Forming An Ultra Low Dielectric Film By Forming An Organosilicon Matrix And Large Porogens As A Template For Increased Porosity App 20080107573 - Schmitt; Francimar ; et al.	2008-05-08
Method For Forming An Ultra Low Dielectric Film By Forming An Organosilicon Matrix And Large Porogens As A Template For Increased Porosity App 20080105978 - Schmitt; Francimar ; et al.	2008-05-08
Multi-stage Curing Of Low K Nano-porous Films App 20080099920 - Schmitt; Francimar ; et al.	2008-05-01
Overall defect reduction for PECVD films App 20080050932 - Lakshmanan; Annamalai ; et al.	2008-02-28
Elimination Of First Wafer Effect For Pecvd Films App 20070281083 - LAKSHMANAN; ANNAMALAI ; et al.	2007-12-06
Situ oxide cap layer development Grant 7,273,823 - Lakshmanan , et al. September 25, 2	2007-09-25
Interface engineering to improve adhesion between low k stacks Grant 7,259,111 - Padhi , et al. August 21, 2	2007-08-21
Strengthening the interface between dielectric layers and barrier layers with an oxide layer of varying composition profile Grant 7,189,658 - Lakshmanan , et al. March 13, 2	2007-03-13
In situ oxide cap layer development App 20060276054 - Lakshmanan; Annamalai ; et al.	2006-12-07
Strengthening the interface between dielectric layers and barrier layers with an oxide layer of varying composition profile App 20060252273 - Lakshmanan; Annamalai ; et al.	2006-11-09
Interface engineering to improve adhesion between low k stacks App 20060160376 - Padhi; Deenesh ; et al.	2006-07-20
Low temperature process to produce low-K dielectrics with low stress by plasma-enhanced chemical vapor deposition (PECVD) App 20060043591 - Yim; Kang Sub ; et al.	2006-03-02
Multi-stage curing of low K nano-porous films App 20050230834 - Schmitt, Francimar ; et al.	2005-10-20
Techniques promoting adhesion of porous low K film to underlying barrier layer App 20050233591 - Schmitt, Francimar ; et al.	2005-10-20
Method for forming an ultra low dielectric film by forming an organosilicon matrix and large porogens as a template for increased porosity App 20050227502 - Schmitt, Francimar ; et al.	2005-10-13
Deposition of low dielectric constant films by N2O addition App 20050214457 - Schmitt, Francimar ; et al.	2005-09-29

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