| Patent | Date |
|---|
Chemical mechanical planarization for tungsten-containing substrates
Grant 11,066,575 - Shi , et al. July 20, 2 | 2021-07-20 |
Low Temperature Mechanical Polishing Or Planarization Slurry For Surfactant Solubility
App 20200308452 - Graham; Maitland G. ; et al. | 2020-10-01 |
Chemical Mechanical Polishing For Copper And Through Silicon Via Applications
App 20200277514 - Shi; Xiaobo ; et al. | 2020-09-03 |
Chemical mechanical polishing (CMP) of cobalt-containing substrate
Grant 10,745,589 - Shi , et al. A | 2020-08-18 |
Barrier Slurry Removal Rate Improvement
App 20200102476 - Gan; Lu ; et al. | 2020-04-02 |
Chemical Mechanical Planarization For Tungsten-Containing Substrates
App 20200079976 - Shi; Xiaobo ; et al. | 2020-03-12 |
Chemical Mechanical Polishing (CMP) of Cobalt-Containing Substrate
App 20190172720 - Shi; Xiaobo ; et al. | 2019-06-06 |
Chemical mechanical polishing (CMP) of cobalt-containing substrate
Grant 10,217,645 - Shi , et al. Feb | 2019-02-26 |
Barrier chemical mechanical planarization slurries using ceria-coated silica abrasives
Grant 10,032,644 - Shi , et al. July 24, 2 | 2018-07-24 |
Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof
Grant 10,011,741 - Shi , et al. July 3, 2 | 2018-07-03 |
Low dishing copper chemical mechanical planarization
Grant 9,978,609 - Shi , et al. May 22, 2 | 2018-05-22 |
Chemical Mechanical Polishing (CMP) of Cobalt-Containing substrate
App 20170362466 - Shi; Xiaobo ; et al. | 2017-12-21 |
Barrier chemical mechanical planarization composition and method thereof
Grant 9,574,110 - Graham , et al. February 21, 2 | 2017-02-21 |
Barrier Chemical Mechanical Planarization Slurries Using Ceria-Coated Silica Abrasives
App 20160358790 - Shi; Xiaobo ; et al. | 2016-12-08 |
Low Dishing Copper Chemical Mechanical Planarization
App 20160314989 - Shi; Xiaobo ; et al. | 2016-10-27 |
Chemical Mechanical Polishing (CMP) Composition for Shallow Trench Isolation (STI) Applications and Methods of Making Thereof
App 20160177134 - Shi; Xiaobo ; et al. | 2016-06-23 |
Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications
Grant 9,305,806 - Shi , et al. April 5, 2 | 2016-04-05 |
Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof
Grant 9,305,476 - Shi , et al. April 5, 2 | 2016-04-05 |
Chemical Mechanical Polishing (CMP) of Colbalt-Containing Substrate
App 20160027657 - Shi; Xiaobo ; et al. | 2016-01-28 |
Chemical Mechanical Polishing (CMP) Composition for Shallow Trench Isolation (STI) Applications and Methods of Making Thereof
App 20150247063 - Shi; Xiaobo ; et al. | 2015-09-03 |
Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof
Grant 9,062,230 - Shi , et al. June 23, 2 | 2015-06-23 |
Chemical Mechanical Polishing Slurry Compositions and Method Using the Same for Copper and Through-Silicon Via Applications
App 20150132956 - Shi; Xiaobo ; et al. | 2015-05-14 |
Barrier Chemical Mechanical Planarization Composition And Method Thereof
App 20150104940 - Graham; Maitland Gary ; et al. | 2015-04-16 |
Barrier Chemical Mechanical Planarization Composition And Method Thereof
App 20150104941 - Graham; Maitland Gary ; et al. | 2015-04-16 |
Chemical mechanical polishing composition having chemical additives and methods for using same
Grant 8,999,193 - Shi , et al. April 7, 2 | 2015-04-07 |
Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications
Grant 8,974,692 - Shi , et al. March 10, 2 | 2015-03-10 |
Chemical Mechanical Polishing Slurry Compositions and Method Using the Same for Copper and Through-Silicon Via Applications
App 20150004788 - SHI; Xiaobo ; et al. | 2015-01-01 |
Chemical Mechanical Polishing (CMP) Composition for Shallow Trench Isolation (STI) Applications and Methods of Making Thereof
App 20140374378 - Shi; Xiaobo ; et al. | 2014-12-25 |
Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof
Grant 8,859,428 - Shi , et al. October 14, 2 | 2014-10-14 |
Chemical Mechanical Planarization for Tungsten-Containing Substrates
App 20140273458 - Shi; Xiaobo ; et al. | 2014-09-18 |
Chemical Mechanical Polishing (cmp) Composition For Shallow Trench Isolation (sti) Applications And Methods Of Making Thereof
App 20140110626 - Shi; Xiaobo ; et al. | 2014-04-24 |
Chemical Mechanical Polishing Composition Having Chemical Additives and Methods for Using Same
App 20140099790 - Shi; Xiaobo ; et al. | 2014-04-10 |
Method for chemical mechanical planarization of chalcogenide materials
Grant 7,678,605 - Schlueter , et al. March 16, 2 | 2010-03-16 |
Method for Chemical Mechanical Planarization of Chalcogenide Materials
App 20090057834 - Schlueter; James Allen ; et al. | 2009-03-05 |
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