| Patent | Date |
|---|
Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask
Grant 11,251,160 - Oggioni , et al. February 15, 2 | 2022-02-15 |
Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
Grant 10,886,254 - Oggioni , et al. January 5, 2 | 2021-01-05 |
Manufacturing Of Flip-chip Electronic Device With Carrier Having Heat Dissipation Elements Free Of Solder Mask
App 20200357774 - OGGIONI; Stefano ; et al. | 2020-11-12 |
Disconnect assembly for active cooling of packaged electronics
Grant 10,767,939 - Schlottig , et al. Sep | 2020-09-08 |
Sealing arrangement
Grant 10,763,189 - Meijer , et al. Sep | 2020-09-01 |
Counter-flow expanding channels for enhanced two-phase heat removal
Grant 10,727,159 - Brunschwiler , et al. | 2020-07-28 |
Counter-flow expanding channels for enhanced two-phase heat removal
Grant 10,727,158 - Brunschwiler , et al. | 2020-07-28 |
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal
App 20200118907 - Brunschwiler; Thomas J. ; et al. | 2020-04-16 |
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal
App 20200091037 - Brunschwiler; Thomas J. ; et al. | 2020-03-19 |
Disconnect Assembly For Active Cooling Of Packaged Electronics
App 20200072562 - Schlottig; Gerd ; et al. | 2020-03-05 |
Heat removal element with thermal expansion coefficient mismatch
Grant 10,551,132 - Schlottig , et al. Fe | 2020-02-04 |
Disconnect Assembly For Active Cooling Of Packaged Electronics
App 20200011617 - Schlottig; Gerd ; et al. | 2020-01-09 |
Counter-flow expanding channels for enhanced two-phase heat removal
Grant 10,529,648 - Brunschwiler , et al. J | 2020-01-07 |
Disconnect assembly for active cooling of packaged electronics
Grant 10,527,365 - Schlottig , et al. J | 2020-01-07 |
High-performance compliant heat-exchanger comprising vapor chamber
Grant 10,388,540 - Brunschwiler , et al. A | 2019-08-20 |
Heat Removal Element With Thermal Expansion Coefficient Mismatch
App 20190162484 - Schlottig; Gerd ; et al. | 2019-05-30 |
Flip-chip Electronic Device With Carrier Having Heat Dissipation Elements Free Of Solder Mask
App 20190043838 - OGGIONI; Stefano ; et al. | 2019-02-07 |
Compliant Heat Sink
App 20180374771 - Meijer; Gerhard I. ; et al. | 2018-12-27 |
Compliant heat sink
Grant 10,157,814 - Meijer , et al. Dec | 2018-12-18 |
Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
Grant 10,153,250 - Oggioni , et al. Dec | 2018-12-11 |
Releasable, threadless conduit connector for liquid manifold
Grant 10,132,433 - Brunschwiler , et al. November 20, 2 | 2018-11-20 |
Releasable, threadless conduit connector for liquid manifold
Grant 10,107,426 - Brunschwiler , et al. October 23, 2 | 2018-10-23 |
High-Performance Compliant Heat-Exchanger Comprising Vapor Chamber
App 20180261522 - Brunschwiler; Thomas ; et al. | 2018-09-13 |
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal
App 20180182686 - Brunschwiler; Thomas J. ; et al. | 2018-06-28 |
Releasable, threadless conduit connector for liquid manifold
Grant 10,006,571 - Brunschwiler , et al. June 26, 2 | 2018-06-26 |
Releasable, Threadless Conduit Connector For Liquid Manifold
App 20180149294 - BRUNSCHWILER; Thomas J. ; et al. | 2018-05-31 |
Counter-flow expanding channels for enhanced two-phase heat removal
Grant 9,941,189 - Brunschwiler , et al. April 10, 2 | 2018-04-10 |
Cooling device with nested chambers for computer hardware
Grant 9,880,595 - Brunschwiler , et al. January 30, 2 | 2018-01-30 |
Optical assembly with optical coupler
Grant 9,864,152 - La Porta , et al. January 9, 2 | 2018-01-09 |
Cooling Device With Nested Chambers For Computer Hardware
App 20170357297 - BRUNSCHWILER; Thomas ; et al. | 2017-12-14 |
Porous Underfill Enabling Rework
App 20170200659 - Gaynes; Michael ; et al. | 2017-07-13 |
Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section
Grant 9,698,089 - Brunschwiler , et al. July 4, 2 | 2017-07-04 |
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal
App 20170179001 - Brunschwiler; Thomas J. ; et al. | 2017-06-22 |
Substrate Device And Electric Circuit Arrangement
App 20160351485 - Brunschwiler; Thomas J. ; et al. | 2016-12-01 |
Flip-chip Electronic Device With Carrier Having Heat Dissipation Elements Free Of Solder Mask
App 20160307874 - OGGIONI; Stefano ; et al. | 2016-10-20 |
Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section
Grant 9,433,077 - Brunschwiler , et al. August 30, 2 | 2016-08-30 |
Integrated helical multi-layer inductor structures
Grant 9,397,042 - Brunschwiler , et al. July 19, 2 | 2016-07-19 |
Releasable, Threadless Conduit Connector For Liquid Manifold
App 20160059367 - BRUNSCHWILER; Thomas J. ; et al. | 2016-03-03 |
Releasable, Threadless Conduit Connector For Liquid Manifold
App 20160061364 - BRUNSCHWILER; Thomas J. ; et al. | 2016-03-03 |
Sealing Arrangement
App 20160061365 - Meijer; Ingmar G. ; et al. | 2016-03-03 |
Method for manufacturing a filled cavity between a first and a second surface
Grant 9,230,832 - Brunschwiler , et al. January 5, 2 | 2016-01-05 |
Method For Manufacturing A Filled Cavity Between A First And A Second Surface
App 20150249022 - Brunschwiler; Thomas J. ; et al. | 2015-09-03 |
Substrate Device And Electric Circuit Arrangement
App 20150237729 - Brunschwiler; Thomas J. ; et al. | 2015-08-20 |
Integrated helical multi-layer inductor structures
App 20150206838 - BRUNSCHWILER; THOMAS J. ; et al. | 2015-07-23 |
Disassemblable electronic assembly with leak-inhibiting coolant capillaries
Grant 9,066,460 - Brunschwiler , et al. June 23, 2 | 2015-06-23 |
Electronic assembly with detachable coolant manifold and coolant-cooled electronic module
Grant 8,937,810 - Brunschwiler , et al. January 20, 2 | 2015-01-20 |
Manufacturing an underfill in a semiconductor chip package
Grant 8,907,503 - Brunschwiler , et al. December 9, 2 | 2014-12-09 |
Disassemblable Electronic Assembly With Leak-inhibiting Coolant Capillaries
App 20140198452 - BRUNSCHWILER; Thomas J. ; et al. | 2014-07-17 |
Electronic Assembly With Detachable Coolant Manifold And Coolant-cooled Electronic Module
App 20140078672 - BRUNSCHWILER; Thomas J. ; et al. | 2014-03-20 |
Manufacturing An Underfill In A Semiconductor Chip Package
App 20140027932 - Brunschwiler; Thomas J. ; et al. | 2014-01-30 |
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