Schloegel; Xaver

Patent Applications and Registrations

Patent applications and USPTO patent grants for Schloegel; Xaver.The latest application filed is for "methods of producing inductor modules and power semiconductor systems having inductor modules".

Company Profile

13.65.74

Schloegel; Xaver - Sachsenkam DE
Schloegel; Xaver - Sachsenkarm N/A DE
Schloegel; Xaver - Sachsenskam DE
Schloegel; Xaver - Sachsenkamm DE
Schloegel; Xaver - Sachsenkarn DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods Of Producing Inductor Modules And Power Semiconductor Systems Having Inductor Modules App 20210036610 - Palm; Petteri ; et al.	2021-02-04
Method of producing an SMD package with top side cooling Grant 10,903,133 - Otremba , et al. January 26, 2	2021-01-26
Semiconductor Package, Semiconductor Assembly And Method For Fabricating A Semiconductor Package App 20210020539 - Otremba; Ralf ; et al.	2021-01-21
Semiconductor package system Grant 10,886,186 - Scharf , et al. January 5, 2	2021-01-05
Methods of manufacturing inductor modules and power semiconductor systems having inductor modules Grant 10,833,583 - Palm , et al. November 10, 2	2020-11-10
Methods of Manufacturing Inductor Modules and Power Semiconductor Systems Having Inductor Modules App 20200212798 - Palm; Petteri ; et al.	2020-07-02
SMD package with flat contacts to prevent bottleneck Grant 10,699,987 - Otremba , et al.	2020-06-30
Reinforcement for electrical connectors Grant 10,700,037 - Cho , et al.	2020-06-30
SMD package with top side cooling Grant 10,699,978 - Otremba , et al.	2020-06-30
Method of Producing an SMD Package with Top Side Cooling App 20200144150 - Otremba; Ralf ; et al.	2020-05-07
Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules Grant 10,601,314 - Palm , et al.	2020-03-24
Method of Manufacturing a Multi-Chip Semiconductor Power Device App 20200083207 - Otremba; Ralf ; et al.	2020-03-12
SMD package with top side cooling Grant 10,566,260 - Otremba , et al. Feb	2020-02-18
Semiconductor Package System App 20190304858 - Scharf; Thorsten ; et al.	2019-10-03
Reinforcement For Electrical Connectors App 20190148332 - Cho; Eung San ; et al.	2019-05-16
Power Semiconductor Systems Having Inductor Modules, and Methods of Manufacturing Inductor Modules and Power Semiconductor Systems Having Inductor Modules App 20190081562 - Palm; Petteri ; et al.	2019-03-14
SMD Package with Top Side Cooling App 20190080980 - Otremba; Ralf ; et al.	2019-03-14
SMD Package with Top Side Cooling App 20190080973 - Otremba; Ralf ; et al.	2019-03-14
Semiconductor chip package having a repeating footprint pattern Grant 10,204,845 - Otremba , et al. Feb	2019-02-12
SMD Package App 20180301398 - Otremba; Ralf ; et al.	2018-10-18
Leadframe and method of manufacturing the same App 20180158758 - OTREMBA; Ralf ; et al.	2018-06-07
Semiconductor component having inner and outer semiconductor component housings Grant 9,991,183 - Hoeglauer , et al. June 5, 2	2018-06-05
Power semiconductor device Grant 9,978,671 - Otremba , et al. May 22, 2	2018-05-22
Semiconductor Chip Package Having a Repeating Footprint Pattern App 20180061745 - Otremba; Ralf ; et al.	2018-03-01
Chip carrier structure, chip package and method of manufacturing the same Grant 9,824,958 - Otremba , et al. November 21, 2	2017-11-21
Lateral element isolation device Grant 9,786,584 - Otremba , et al. October 10, 2	2017-10-10
Semiconductor housing with rear-side structuring Grant 9,627,292 - Otremba , et al. April 18, 2	2017-04-18
Method of Manufacturing a Multi-Chip Semiconductor Power Device App 20170047315 - Otremba; Ralf ; et al.	2017-02-16
Multi-chip semiconductor power device Grant 9,515,060 - Otremba , et al. December 6, 2	2016-12-06
Semiconductor packages having multiple lead frames and methods of formation thereof Grant 9,449,902 - Otremba , et al. September 20, 2	2016-09-20
Method for manufacturing a chip arrangement Grant 9,412,626 - Otremba , et al. August 9, 2	2016-08-09
Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit Grant 9,397,018 - Otremba , et al. July 19, 2	2016-07-19
Module comprising a semiconductor chip Grant 9,379,046 - Otremba , et al. June 28, 2	2016-06-28
Electronic device Grant 9,362,240 - Hosseini , et al. June 7, 2	2016-06-07
Semiconductor Component Having Inner and Outer Semiconductor Component Housings App 20160111346 - Hoeglauer; Josef ; et al.	2016-04-21
Method For Manufacturing A Chip Arrangement App 20160064255 - Otremba; Ralf ; et al.	2016-03-03
Leadframe and method of manufacturing the same App 20160056092 - OTREMBA; Ralf ; et al.	2016-02-25
Power transistor arrangement and package having the same Grant 9,263,440 - Otremba , et al. February 16, 2	2016-02-16
Electronic device and method for fabricating an electronic device Grant 9,230,880 - Otremba , et al. January 5, 2	2016-01-05
Chip arrangements and methods for manufacturing a chip arrangement Grant 9,184,066 - Otremba , et al. November 10, 2	2015-11-10
Module Comprising a Semiconductor Chip App 20150294926 - Otremba; Ralf ; et al.	2015-10-15
Semiconductor power device having a heat sink Grant 9,147,631 - Otremba , et al. September 29, 2	2015-09-29
Package-in-packages and methods of formation thereof Grant 9,147,628 - Otremba , et al. September 29, 2	2015-09-29
Power Semiconductor Device App 20150270208 - OTREMBA; Ralf ; et al.	2015-09-24
Chip module, an insulation material and a method for fabricating a chip module Grant 9,117,786 - Otremba , et al. August 25, 2	2015-08-25
Power transistor arrangement and method for manufacturing the same Grant 9,099,441 - Otremba , et al. August 4, 2	2015-08-04
Electronic Device and Method for Fabricating an Electronic Device App 20150214133 - Otremba; Ralf ; et al.	2015-07-30
Electronic Device App 20150162287 - Hosseini; Khalil ; et al.	2015-06-11
Chip module and a method for manufacturing a chip module Grant 8,987,880 - Hoeglauer , et al. March 24, 2	2015-03-24
Semiconductor device using diffusion soldering Grant 8,975,117 - Otremba , et al. March 10, 2	2015-03-10
Semiconductor Packages Having Multiple Lead Frames and Methods of Formation Thereof App 20150060878 - Otremba; Ralf ; et al.	2015-03-05
Semiconductor packages having multiple lead frames and methods of formation thereof Grant 8,896,106 - Otremba , et al. November 25, 2	2014-11-25
Semiconductor Power Device Having a Heat Sink App 20140312360 - Otremba; Ralf ; et al.	2014-10-23
Chip And Chip Arrangement App 20140306331 - Otremba; Ralf ; et al.	2014-10-16
Package arrangement and a method of manufacturing a package arrangement Grant 8,853,849 - Otremba , et al. October 7, 2	2014-10-07
Multi-Chip Semiconductor Power Device App 20140284777 - Otremba; Ralf ; et al.	2014-09-25
Chip Carrier Structure, Chip Package And Method Of Manufacturing The Same App 20140252577 - Otremba; Ralf ; et al.	2014-09-11
Package Arrangement And A Method Of Manufacturing A Package Arrangement App 20140252537 - Otremba; Ralf ; et al.	2014-09-11
Power Transistor Arrangement And Package Having The Same App 20140225124 - Otremba; Ralf ; et al.	2014-08-14
Power Transistor Arrangement And Method For Manufacturing The Same App 20140217596 - Otremba; Ralf ; et al.	2014-08-07
Chip Arrangement, A Method For Manufacturing A Chip Arrangement, Integrated Circuits And A Method For Manufacturing An Integrated Circuit App 20140197552 - Otremba; Ralf ; et al.	2014-07-17
Chip Module, an Insulation Material and a Method for Fabricating a Chip Module App 20140151856 - Otremba; Ralf ; et al.	2014-06-05
Chip Arrangements And Methods For Manufacturing A Chip Arrangement App 20140138803 - Otremba; Ralf ; et al.	2014-05-22
Module Comprising a Semiconductor Chip App 20140110829 - Otremba; Ralf ; et al.	2014-04-24
Module with silicon-based layer Grant 8,697,497 - Otremba , et al. April 15, 2	2014-04-15
Semiconductor Housing with Rear-Side Structuring App 20140084449 - Otremba; Ralf ; et al.	2014-03-27
Lateral Element Isolation Device App 20140063766 - Otremba; Ralf ; et al.	2014-03-06
Power semiconductor chip having two metal layers on one face Grant 8,643,176 - Otremba , et al. February 4, 2	2014-02-04
Semiconductor module Grant 8,637,341 - Otremba , et al. January 28, 2	2014-01-28
Module comprising a semiconductor chip Grant 8,633,102 - Otremba , et al. January 21, 2	2014-01-21
Semiconductor Packages Having Multiple Lead Frames and Methods of Formation Thereof App 20140008702 - Otremba; Ralf ; et al.	2014-01-09
Package-In-Packages and Methods of Formation Thereof App 20140001615 - Otremba; Ralf ; et al.	2014-01-02
Semiconductor Device Using Diffusion Soldering App 20130200532 - Otremba; Ralf ; et al.	2013-08-08
Semiconductor Device and Fabrication Method App 20130154123 - Poh; Yong Chern ; et al.	2013-06-20
Semiconductor device and method for producing the same Grant 8,410,592 - Otremba , et al. April 2, 2	2013-04-02
Chip Module And A Method For Manufacturing A Chip Module App 20130062722 - Hoeglauer; Josef ; et al.	2013-03-14
Power Semiconductor Chip Having Two Metal Layers on One Face App 20130027113 - Otremba; Ralf ; et al.	2013-01-31
Stacked semiconductor chips with separate encapsulations Grant 8,334,586 - Otremba , et al. December 18, 2	2012-12-18
Module Comprising a Semiconductor Chip App 20120276693 - Otremba; Ralf ; et al.	2012-11-01
Module comprising a semiconductor chip Grant 8,237,268 - Otremba , et al. August 7, 2	2012-08-07
Module With Silicon-based Layer App 20120070941 - Otremba; Ralf ; et al.	2012-03-22
Multichip module with improved system carrier Grant 8,115,294 - Otremba , et al. February 14, 2	2012-02-14
Module with silicon-based layer Grant 8,093,713 - Otremba , et al. January 10, 2	2012-01-10
Semiconductor module Grant 8,030,131 - Otremba , et al. October 4, 2	2011-10-04
Stacked Semiconductor Chips App 20110215460 - Otremba; Ralf ; et al.	2011-09-08
Stacked semiconductor chips with separate encapsulations Grant 7,969,018 - Otremba , et al. June 28, 2	2011-06-28
Semiconductor module for a switched-mode power supply and method for its assembly Grant 7,923,827 - Heng , et al. April 12, 2	2011-04-12
Semiconductor device Grant 7,851,908 - Otremba , et al. December 14, 2	2010-12-14
Semiconductor module Grant 7,759,163 - Kroeninger , et al. July 20, 2	2010-07-20
Semiconductor module Grant 7,759,777 - Otremba , et al. July 20, 2	2010-07-20
Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same Grant 7,732,929 - Otremba , et al. June 8, 2	2010-06-08
Method for making a device including placing a semiconductor chip on a substrate Grant 7,727,813 - Otremba , et al. June 1, 2	2010-06-01
Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same Grant 7,728,415 - Hosseini , et al. June 1, 2	2010-06-01
Device including a semiconductor chip having a plurality of electrodes Grant 7,701,065 - Otremba , et al. April 20, 2	2010-04-20
Power semiconductor component, power semiconductor device as well as methods for their production Grant 7,667,326 - Hoeglauer , et al. February 23, 2	2010-02-23
Stacked Semiconductor Chips App 20100013106 - Otremba; Ralf ; et al.	2010-01-21
Semiconductor component having a semiconductor die and a leadframe Grant 7,629,676 - Otremba , et al. December 8, 2	2009-12-08
Electrically conductive connection, electronic component and method for their production Grant 7,626,262 - Otremba , et al. December 1, 2	2009-12-01
Semiconductor Module App 20090261468 - Kroeninger; Werner ; et al.	2009-10-22
Semiconductor Device App 20090230519 - OTREMBA; Ralf ; et al.	2009-09-17
Semiconductor Module App 20090230535 - Otremba; Ralf ; et al.	2009-09-17
Semiconductor device comprising a vertical semiconductor component and method for producing the same Grant 7,589,413 - Otremba , et al. September 15, 2	2009-09-15
Semiconductor Module App 20090227071 - Otremba; Ralf ; et al.	2009-09-10
Method For Making A Device Including Placing A Semiconductor Chip On A Substrate App 20090137086 - Otremba; Ralf ; et al.	2009-05-28
Device Including A Semiconductor Chip Having A Plurality Of Electrodes App 20090108460 - Otremba; Ralf ; et al.	2009-04-30
Semiconductor Device App 20090001562 - Otremba; Ralf ; et al.	2009-01-01
Semiconductor Module for a Switched-Mode Power Supply and Method for Its Assembly App 20090001535 - Heng; Yang Hong ; et al.	2009-01-01
Semiconductor Module App 20080251903 - Otremba; Ralf ; et al.	2008-10-16
Module comprising a semiconductor chip App 20080230928 - Otremba; Ralf ; et al.	2008-09-25
Module With Silicon-based Layer App 20080191339 - Otremba; Raif ; et al.	2008-08-14
Semiconductor and Method For Producing the Same App 20080185740 - Schloegel; Xaver ; et al.	2008-08-07
Power Semiconductor Component Stack Using Lead Technology with Surface-Mountable External Contacts and a Method for Producing the Same App 20080150105 - Hosseini; Khalil ; et al.	2008-06-26
Semiconductor Device and Method for Producing the Same App 20080087913 - Otremba; Ralf ; et al.	2008-04-17
Semiconductor component having a semiconductor die and a leadframe App 20080061413 - Otremba; Ralf ; et al.	2008-03-13
Semiconductor Component With Cooling Apparatus App 20080054449 - Hirler; Franz ; et al.	2008-03-06
Electrically Conductive Connection, Electronic Component and Method for Their Production App 20070290337 - Otremba; Ralf ; et al.	2007-12-20
Power Semiconductor Component, Power Semiconductor Device As Well As Methods For Their Production App 20070246838 - Hoeglauer; Josef ; et al.	2007-10-25
Multichip Module With Improved System Carrier App 20070216011 - Otremba; Ralf ; et al.	2007-09-20
Semiconductor Device Comprising A Vertical Semiconductor Component And Method For Producing The Same App 20070138634 - Otremba; Ralf ; et al.	2007-06-21
Power Semiconductor Component With Semiconductor Chip Stack In A Bridge Circuit And Method For Producing The Same App 20070132079 - Otremba; Ralf ; et al.	2007-06-14
Semiconductor component with insulating housing Grant 5,821,618 - Graf , et al. October 13, 1	1998-10-13