SCHLAFFER; Erich

Patent Applications and Registrations

Patent applications and USPTO patent grants for SCHLAFFER; Erich.The latest application filed is for "opposing planar electrically conductive surfaces connected for establishing a two-dimensional electric connection area between component carrier stacks".

Company Profile

10.8.15

SCHLAFFER; Erich - St. Lorenzen AT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Opposing Planar Electrically Conductive Surfaces Connected for Establishing a Two-Dimensional Electric Connection Area Between Component Carrier Stacks App 20220248532 - REITMAIER; Bernhard ; et al.	2022-08-04
Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed Structure Forming an Antenna App 20220190464 - Gavagnin; Marco ; et al.	2022-06-16
Component carrier with opposed stacks having respective connection bodies and a method for manufacturing the component carrier Grant 11,322,482 - Reitmaier , et al. May 3, 2	2022-05-03
Component carrier with integrated antenna structure Grant 11,264,708 - Kristl , et al. March 1, 2	2022-03-01
RF functionality and electromagnetic radiation shielding in a component carrier Grant 11,201,119 - Leitgeb , et al. December 14, 2	2021-12-14
Component carrier comprising a double layer structure Grant 11,197,367 - Gavagnin , et al. December 7, 2	2021-12-07
Component Carrier With a Solid Body Protecting a Component Carrier Hole From Foreign Material Ingression App 20210360795 - Schlaffer; Erich ; et al.	2021-11-18
Component Carrier With an Embedded Thermally Conductive Block and Manufacturing Method App 20210337653 - Schlaffer; Erich ; et al.	2021-10-28
Component carrier with high passive intermodulation performance Grant 11,140,768 - Poltl , et al. October 5, 2	2021-10-05
Electronic Device Having an Electronic Component Packaged in a Compact Component Carrier With Shielding Cavities App 20210059044 - Gentili; Fabrizio ; et al.	2021-02-25
Opposing Planar Electrically Conductive Surfaces Connected for Establishing a Two-Dimensional Electric Connection Area Between Component Carrier Stacks App 20210013182 - Reitmaier; Bernhard ; et al.	2021-01-14
Component carrier comprising at least one heat pipe and method for producing said component carrier Grant 10,867,888 - de Sousa , et al. December 15, 2	2020-12-15
Component Carrier Comprising a Double Layer Structure App 20200329555 - Gavagnin; Marco ; et al.	2020-10-15
Component Carrier With High Passive Intermodulation Performance App 20200329552 - Poltl; Kevin ; et al.	2020-10-15
Component Carrier And Method of Manufacturing the Same App 20200329563 - Silvano De Sousa; Jonathan ; et al.	2020-10-15
Component Carrier Comprising at Least One Heat Pipe and Method for Producing Said Component Carrier App 20200243417 - de Sousa; Jonathan Silvano ; et al.	2020-07-30
Component carrier comprising at least one heat pipe and method for producing said component carrier Grant 10,665,526 - de Sousa , et al.	2020-05-26
RF Functionality and Electromagnetic Radiation Shielding in a Component Carrier App 20190378801 - Leitgeb; Markus ; et al.	2019-12-12
Printed circuit board product with antenna structure and method for its production Grant 10,490,887 - Schlaffer Nov	2019-11-26
Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed Structure App 20190110366 - Gavagnin; Marco ; et al.	2019-04-11
Component Carrier With Integrated Antenna Structure App 20180277943 - Kristl; Thomas ; et al.	2018-09-27
Component Carrier Comprising at Least One Heat Pipe and Method for Producing Said Component Carrier App 20180096912 - de Sousa; Jonathan Silvano ; et al.	2018-04-05
Printed Circuit Board Product With Antenna Structure And Method For Its Production App 20170250466 - Schlaffer; Erich	2017-08-31

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