Schinella; Richard

Patent Applications and Registrations

Patent applications and USPTO patent grants for Schinella; Richard.The latest application filed is for "method for growing thin films".

Company Profile

0.12.5

Schinella; Richard - Saratoga CA
Schinella; Richard - Portland OR
Schinella; Richard - Saritoga CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for growing thin films Grant 7,081,296 - Aronowitz , et al. July 25, 2	2006-07-25
Process for planarizing upper surface of damascene wiring structure for integrated circuit structures Grant 6,881,664 - Catabay , et al. April 19, 2	2005-04-19
Low k dielectric composite layer for integrated circuit structure which provides void-free low k dielectric material between metal lines while mitigating via poisoning Grant 6,800,940 - Catabay , et al. October 5, 2	2004-10-05
Method for growing thin films App 20040175947 - Aronowitz, Sheldon ; et al.	2004-09-09
Self-aligned alloy capping layers for copper interconnect structures Grant 6,747,358 - Rissman , et al. June 8, 2	2004-06-08
Method for growing thin films Grant 6,743,474 - Aronowitz , et al. June 1, 2	2004-06-01
Method of forming SiGe gate electrode Grant 6,730,588 - Schinella May 4, 2	2004-05-04
Process for planarizing upper surface of damascene wiring structure for integrated circuit structures App 20040009668 - Catabay, Wilbur G. ; et al.	2004-01-15
Method for reticle formation utilizing metal vaporization Grant 6,673,498 - Aronowitz , et al. January 6, 2	2004-01-06
Method for creating self-aligned alloy capping layers for copper interconnect structures Grant 6,566,262 - Rissman , et al. May 20, 2	2003-05-20
Method and apparatus for application of proximity correction with relative segmentation Grant 6,532,585 - Petranovic , et al. March 11, 2	2003-03-11
Process for forming metal-filled openings in low dielectric constant dielectric material while inhibiting via poisoning Grant 6,503,840 - Catabay , et al. January 7, 2	2003-01-07
Method and apparatus for application of proximity correction with unitary segmentation Grant 6,499,003 - Jones , et al. December 24, 2	2002-12-24
Process for forming metal-filled openings in low dielectric constant dielectric material while inhibiting via poisoning App 20020164877 - Catabay, Wilbur G. ; et al.	2002-11-07
Low k dielectric composite layer for integrated circuit structure which provides void-free low k dielectric material between metal lines while mitigating via poisoning App 20020123243 - Catabay, Wilbur G. ; et al.	2002-09-05
Low k dielectric composite layer for intergrated circuit structure which provides void-free low k dielectric material between metal lines while mitigating via poisoning Grant 6,391,795 - Catabay , et al. May 21, 2	2002-05-21
Method And Apparatus For Application Of Proximity Correction With Unitary Segmentation App 20020004714 - JONES, EDWIN ; et al.	2002-01-10

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