Schilling; Paul E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Schilling; Paul E..The latest application filed is for "ionic fluid in supercritical fluid for semiconductor processing".

Company Profile

0.4.7

Schilling; Paul E. - Granite Bay CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module Grant 7,208,411 - Biberger , et al. April 24, 2	2007-04-24
Ionic fluid in supercritical fluid for semiconductor processing App 20050227187 - Schilling, Paul E.	2005-10-13
Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module Grant 6,890,853 - Biberger , et al. May 10, 2	2005-05-10
Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module App 20040229449 - Biberger, Maximilian A. ; et al.	2004-11-18
Oxidizing polishing slurries for low dielectric constant materials App 20040192172 - Towery, Dan ; et al.	2004-09-30
Tetra-organic ammonium fluoride and HF in supercritical fluid for photoresist and residue removal App 20040177867 - Schilling, Paul E.	2004-09-16
Fluoride in supercritical fluid for photoresist and residue removal App 20040112409 - Schilling, Paul E.	2004-06-17
Removal of photoresist and residue from substrate using supercritical carbon dioxide process Grant 6,500,605 - Mullee , et al. December 31, 2	2002-12-31
Oxidizing polishing slurries for low dielectric constant materials App 20020009955 - Towery, Daniel L. ; et al.	2002-01-24
Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module App 20020001929 - Biberger, Maximilian A. ; et al.	2002-01-03
Poly(arylene ether) compositions and methods of manufacture thereof Grant 6,124,421 - Lau , et al. September 26, 2	2000-09-26

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