| Patent | Date |
|---|
System, Method, And Device For Forming An Array Of Emulsions
App 20220097068 - CAULEY, III; Thomas Henry ; et al. | 2022-03-31 |
System, method, and device for forming an array of emulsions
Grant 11,207,685 - Cauley, III , et al. December 28, 2 | 2021-12-28 |
Microfluidic system with fluid pickups
Grant 10,682,647 - Makarewicz, Jr. , et al. | 2020-06-16 |
P--N separation metal fill for flip chip LEDs
Grant 10,170,675 - Lei , et al. J | 2019-01-01 |
Sealed Semiconductor Light Emitting Device
App 20180323353 - Lei; Jipu ; et al. | 2018-11-08 |
System, Method, And Device For Forming An Array Of Emulsions
App 20180229239 - CAULEY; Trey ; et al. | 2018-08-16 |
Assay Performance Systems Including Aqueous Sample Stabilization
App 20180209874 - Cater; Sean ; et al. | 2018-07-26 |
Sealed semiconductor light emitting device
Grant 10,020,431 - Lei , et al. July 10, 2 | 2018-07-10 |
Reducing solder pad topology differences by planarization
Grant 9,935,069 - Lei , et al. April 3, 2 | 2018-04-03 |
Led Having Vertical Contacts Redistributed For Flip Chip Mounting
App 20180019370 - Lei; Jipu ; et al. | 2018-01-18 |
P-n Separation Metal Fill For Flip Chip Leds
App 20170373235 - Lei; Jipu ; et al. | 2017-12-28 |
Microfluidic System With Fluid Pickups
App 20170291174 - Makarewicz, JR.; Anthony J. ; et al. | 2017-10-12 |
LED having vertical contacts redistributed for flip chip mounting
Grant 9,722,137 - Lei , et al. August 1, 2 | 2017-08-01 |
Droplet Assay System With Automatic Calibration
App 20170189908 - Dzenitis; John ; et al. | 2017-07-06 |
Microfluidic system with fluid pickups
Grant 9,687,848 - Makarewicz, Jr. , et al. June 27, 2 | 2017-06-27 |
Light emitting device with reduced epi stress
Grant 9,660,164 - Diana , et al. May 23, 2 | 2017-05-23 |
Method of separating a wafer of semiconductor devices
Grant 9,608,016 - Lei , et al. March 28, 2 | 2017-03-28 |
Microfluidic System With Fluid Pickups
App 20160339436 - Makarewicz, JR.; Anthony J. ; et al. | 2016-11-24 |
Semiconductor light emitting device with thick metal layers
Grant 9,484,513 - Schiaffino , et al. November 1, 2 | 2016-11-01 |
Semiconductor Light Emitting Device With Thick Metal Layers
App 20160233400 - Schiaffino; Stefano ; et al. | 2016-08-11 |
Microfluidic system with fluid pickups
Grant 9,409,174 - Makarewicz, Jr. , et al. August 9, 2 | 2016-08-09 |
Chip scale light emitting device with metal pillars in a molding compound formed at wafer level
Grant 9,406,857 - Lei , et al. August 2, 2 | 2016-08-02 |
Reducing Solder Pad Topology Differences By Planarization
App 20160181216 - Lei; Jipu ; et al. | 2016-06-23 |
Led Having Vertical Contacts Redistributed For Flip Chip Mounting
App 20160126408 - Lei; Jipu ; et al. | 2016-05-05 |
P-n Separation Metal Fill For Flip Chip Leds
App 20160126436 - Lei; Jipu ; et al. | 2016-05-05 |
Semiconductor light emitting device with thick metal layers
Grant 9,324,927 - Schiaffino , et al. April 26, 2 | 2016-04-26 |
LED having vertical contacts redistruted for flip chip mounting
Grant 9,246,061 - Lei , et al. January 26, 2 | 2016-01-26 |
Light Emitting Device With Reduced Epi Stress
App 20150318459 - DIANA; FREDERIC STEPHANE ; et al. | 2015-11-05 |
Light emitting device with reduced EPI stress
Grant 9,093,630 - Diana , et al. July 28, 2 | 2015-07-28 |
Method of bonding a semiconductor device using a compliant bonding structure
Grant 9,076,944 - Neff , et al. July 7, 2 | 2015-07-07 |
Chip Scale Light Emitting Device With Metal Pillars In A Molding Compound Formed At Wafer Level
App 20150144971 - Lei; Jipu ; et al. | 2015-05-28 |
Method Of Separating A Wafer Of Semiconductor Devices
App 20150140711 - Lei; Jipu ; et al. | 2015-05-21 |
Sealed Semiconductor Light Emitting Device
App 20150076538 - Lei; Jipu ; et al. | 2015-03-19 |
Microfluidic System With Fluid Pickups
App 20140378348 - Makarewicz, JR.; Anthony J. ; et al. | 2014-12-25 |
Semiconductor Light Emitting Device With Thick Metal Layers
App 20140339597 - Schiaffino; Stefano ; et al. | 2014-11-20 |
Led Having Vertical Contacts Redistruted For Flip Chip Mounting
App 20130334563 - Lei; Jipu ; et al. | 2013-12-19 |
Light Emitting Device With Reduce Epi Stress
App 20130193476 - Diana; Frederic Stephane ; et al. | 2013-08-01 |
LED assembly having maximum metal support for laser lift-off of growth substrate
Grant 8,384,118 - Schiaffino , et al. February 26, 2 | 2013-02-26 |
Method Of Bonding A Semiconductor Device Using A Compliant Bonding Structure
App 20120225505 - Neff; James G. ; et al. | 2012-09-06 |
Method of bonding a semiconductor device using a compliant bonding structure
Grant 8,202,741 - Neff , et al. June 19, 2 | 2012-06-19 |
Compliant bonding structures for semiconductor devices
Grant 8,053,905 - Epler , et al. November 8, 2 | 2011-11-08 |
Extension of contact pads to the die edge via electrical isolation
Grant 7,977,132 - Margalith , et al. July 12, 2 | 2011-07-12 |
Compliant Bonding Structures For Semiconductor Devices
App 20110114987 - Epler; John E. ; et al. | 2011-05-19 |
Thin-film Flip-chip Series Connected Leds
App 20110018013 - MARGALITH; Tal ; et al. | 2011-01-27 |
Electrical contacts for a semiconductor light emitting apparatus
Grant 7,842,963 - Schiaffino , et al. November 30, 2 | 2010-11-30 |
Extension Of Contact Pads To The Die Edge Via Electrical Isolation
App 20100283080 - MARGALITH; Tal ; et al. | 2010-11-11 |
Method Of Bonding A Semiconductor Device Using A Compliant Bonding Structure
App 20100227421 - Neff; James G. ; et al. | 2010-09-09 |
Led Assembly Having Maximum Metal Support For Laser Lift-off Of Growth Substrate
App 20100207157 - SCHIAFFINO; Stefano ; et al. | 2010-08-19 |
LED assembly having maximum metal support for laser lift-off of growth substrate
Grant 7,736,945 - Schiaffino , et al. June 15, 2 | 2010-06-15 |
Combination Therapy
App 20100004193 - ABRAHAM; Reimar ; et al. | 2010-01-07 |
Flexible circuit for establishing electrical connectivity with optical subassembly
Grant 7,439,449 - Kumar , et al. October 21, 2 | 2008-10-21 |
Interconnects for semiconductor light emitting devices
App 20080142833 - Schiaffino; Stefano ; et al. | 2008-06-19 |
Electrical Contacts for a Semiconductor Light Emitting Apparatus
App 20080096297 - Schiaffino; Stefano ; et al. | 2008-04-24 |
Devices for reflection reduction in optical devices
Grant 7,354,201 - Aronson , et al. April 8, 2 | 2008-04-08 |
Interconnects for semiconductor light emitting devices
Grant 7,348,212 - Schiaffino , et al. March 25, 2 | 2008-03-25 |
LED Assembly Having Maximum Metal Support for Laser Lift-Off of Growth Substrate
App 20070096130 - Schiaffino; Stefano ; et al. | 2007-05-03 |
Optoelectronic components with multi-layer feedthrough structure
Grant 7,210,859 - Kumar , et al. May 1, 2 | 2007-05-01 |
Interconnects for semiconductor light emitting devices
App 20070057271 - Schiaffino; Stefano ; et al. | 2007-03-15 |
Small form factor transceiver with externally modulated laser
Grant 7,066,659 - Aronson , et al. June 27, 2 | 2006-06-27 |
Small form factor transceiver with externally modulated laser
Grant 6,996,304 - Aronson , et al. February 7, 2 | 2006-02-07 |
Receive optical assembly with angled optical receiver
App 20050196173 - Schiaffino, Stefano ; et al. | 2005-09-08 |
Header assembly for optoelectronic devices
Grant 6,911,599 - Rosenberg , et al. June 28, 2 | 2005-06-28 |
Small form factor transceiver with externally modulated laser
App 20050135777 - Aronson, Lewis B. ; et al. | 2005-06-23 |
Optoelectronic components with multi-layer feedthrough structure
App 20050089280 - Kumar, Dev E. ; et al. | 2005-04-28 |
Small form factor optical transceiver with extended transmission range
Grant 6,878,875 - Aronson , et al. April 12, 2 | 2005-04-12 |
Multi-layer ceramic feedthrough structure in a transmitter optical subassembly
Grant 6,867,368 - Kumar , et al. March 15, 2 | 2005-03-15 |
Cooled externally modulated laser for transmitter optical subassembly
Grant 6,852,928 - Giaretta , et al. February 8, 2 | 2005-02-08 |
Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly
Grant 6,841,733 - Schiaffino , et al. January 11, 2 | 2005-01-11 |
Header assembly for optoelectronic devices
App 20040168819 - Rosenberg, Paul K. ; et al. | 2004-09-02 |
Multi-layer ceramic feedthrough structure in a transmitter optical subassembly
App 20040163836 - Kumar, Dev E. ; et al. | 2004-08-26 |
Small form factor optical transceiver with extended transmission range
App 20040151505 - Aronson, Lewis B. ; et al. | 2004-08-05 |
Cooled externally modulated laser for transmitter optical subassembly
App 20040129441 - Giaretta, Giorgio ; et al. | 2004-07-08 |
Devices for reflection reduction in optical devices
App 20040101258 - Aronson, Lewis B. ; et al. | 2004-05-27 |
Small form factor transceiver with externally modulated laser
App 20040081410 - Aronson, Lewis B. ; et al. | 2004-04-29 |
Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly
App 20040074661 - Schiaffino, Stefano ; et al. | 2004-04-22 |
Header assembly having integrated cooling device
Grant 6,703,561 - Rosenberg , et al. March 9, 2 | 2004-03-09 |
Ceramic header assembly
Grant 6,586,678 - Rosenberg , et al. July 1, 2 | 2003-07-01 |
Optical switching using bubble-driven droplet
App 20030077027 - Schiaffino, Stefano ; et al. | 2003-04-24 |
Alignment of ink dots in an inkjet printer
Grant 6,367,903 - Gast , et al. April 9, 2 | 2002-04-09 |
Correction system for droplet placement errors in the scan axis in inkjet printers
Grant 6,364,447 - Boleda , et al. April 2, 2 | 2002-04-02 |
System and method for providing temperature control for a thermally activated optical switch using constant total power
Grant 6,327,397 - Schiaffino , et al. December 4, 2 | 2001-12-04 |
Optical switching device and method utilizing fluid pressure control to improve switching characteristics
Grant 6,188,815 - Schiaffino , et al. February 13, 2 | 2001-02-13 |
Bubble valve and bubble valve-based pressure regulator
Grant 6,062,681 - Field , et al. May 16, 2 | 2000-05-16 |
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