Scheucher; Heimo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Scheucher; Heimo.The latest application filed is for "maximizing potential good die per wafer, pgdw".

Company Profile

0.18.16

Scheucher; Heimo - Gratkorn AT
Scheucher; Heimo - Langegg AT
Scheucher; Heimo - A-8302 Langegg AT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Maximizing potential good die per wafer, PGDW Grant 9,798,228 - Cobussen , et al. October 24, 2	2017-10-24
Semiconductor wafer and method of producing the same Grant 9,754,832 - Schmitt , et al. September 5, 2	2017-09-05
Integrated circuits on a wafer and methods for manufacturing integrated circuits Grant 9,620,456 - Scheucher April 11, 2	2017-04-11
Maximizing Potential Good Die Per Wafer, Pgdw App 20170092636 - Kamphuis; Tonny ; et al.	2017-03-30
Chip having two groups of chip contacts Grant 9,318,428 - Scheucher April 19, 2	2016-04-19
Individual ROM codes on a single reticle for a plurality of devices Grant 8,701,077 - Lemsitzer , et al. April 15, 2	2014-04-15
Integrated circuits on a wafer and method for separating integrated circuits on a wafer Grant 8,415,769 - Scheucher , et al. April 9, 2	2013-04-09
Integrated circuits on a wafer and methods for manufacturing integrated circuits Grant 8,349,708 - Scheucher , et al. January 8, 2	2013-01-08
Semiconductor wafer and method of producing the same App 20120306056 - Schmitt; Florian ; et al.	2012-12-06
Integrated circuits on a wafer and method of producing integrated circuits Grant 8,264,092 - Scheucher September 11, 2	2012-09-11
Data carrier comprising strain gauge means Grant 7,884,722 - Scheucher , et al. February 8, 2	2011-02-08
Integrated Circuits On A Wafer and Method For Separating Integrated Circuits On A Wafer App 20100270655 - Scheucher; Heimo ; et al.	2010-10-28
Data Carrier Comprising Strain Gauge Means App 20100225483 - Scheucher; Heimo ; et al.	2010-09-09
Integrated Circuits On A Wafer And Methods For Manufacturing Integrated Circuits App 20100181568 - Scheucher; Heimo ; et al.	2010-07-22
Integrated Circuits On A Wafer And Method Of Producing Integrated Circuits App 20100155967 - Scheucher; Heimo	2010-06-24
Integrated Circuits On A Wafer And Methods For Manufacturing Integrated Circuits App 20100140748 - Scheucher; Heimo	2010-06-10
Wafer with optical control modules in exposure fields Grant 7,538,444 - Scheucher , et al. May 26, 2	2009-05-26
Wafer with optical control modules in dicing paths Grant 7,508,051 - Scheucher March 24, 2	2009-03-24
Wafer with optical control modules in IC fields Grant 7,456,489 - Scheucher November 25, 2	2008-11-25
Chip Comprising at Least One Test Contact Configuration App 20080067509 - Scheucher; Heimo ; et al.	2008-03-20
Chip Having Two Groups Of Chip Contacts App 20080017980 - Scheucher; Heimo	2008-01-24
Wafer With Improved Sawing Loops App 20080001259 - Scheucher; Heimo	2008-01-03
Integrated circuit with at least one bump Grant 7,247,943 - Scheucher July 24, 2	2007-07-24
Wafer with optical control modules in ic fields App 20070158798 - Scheucher; Heimo	2007-07-12
Wafer with optical control modules in exposure fields App 20070152303 - Scheucher; Heimo ; et al.	2007-07-05
Wafer with optical control modules in dicing paths App 20070111352 - Scheucher; Heimo	2007-05-17
Electro-acoustic transducer comprising an rfid circuit App 20070086605 - Scheucher; Heimo	2007-04-19
Integrated circuit with at least one bump App 20060071240 - Scheucher; Heimo	2006-04-06
Semiconductor wafer with process control modules Grant 6,680,523 - Schober , et al. January 20, 2	2004-01-20
Semiconductor wafer with process control modules App 20020117735 - Schober, Joachim H. ; et al.	2002-08-29

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