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Semiconductor chip package comprising a leadframe connected to a substrate and a semiconductor chip, and a method for fabricating the same Grant 11,037,856 - Neugirg , et al. June 15, 2 | 2021-06-15 |
Flat Lead Package Formation Method App 20210043603 - Meyer; Thorsten ;   et al. | 2021-02-11 |
Semiconductor Chip Package Comprising Substrate, Semiconductor Chip, And Leadframe And A Method For Fabricating The Same App 20200251400 - Kind Code | 2020-08-06 |
Multi-Purpose Non-Linear Semiconductor Package Assembly Line App 20200203310 - Meyer; Thorsten ;   et al. | 2020-06-25 |
Multi-purpose non-linear semiconductor package assembly line Grant 10,566,309 - Meyer , et al. Feb | 2020-02-18 |
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Multi-Purpose Non-Linear Semiconductor Package Assembly Line App 20180096966 - Meyer; Thorsten ;   et al. | 2018-04-05 |
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