Scherl; Peter

Patent Applications and Registrations

Patent applications and USPTO patent grants for Scherl; Peter.The latest application filed is for "semiconductor chip package comprising substrate, semiconductor chip, and leadframe and a method for fabricating the same".

Company Profile

5.14.15

Scherl; Peter - Regensburg DE
Scherl; Peter - Neunburg v.W. DE
Scherl; Peter - Nuremberg DE
Scherl; Peter - Kapfenberg OE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-purpose non-linear semiconductor package assembly line Grant 11,302,668 - Meyer , et al. April 12, 2	2022-04-12
Semiconductor Chip Package Comprising Substrate, Semiconductor Chip, And Leadframe And A Method For Fabricating The Same App 20210193556 - NEUGIRG; Christian ; et al.	2021-06-24
Semiconductor chip package comprising a leadframe connected to a substrate and a semiconductor chip, and a method for fabricating the same Grant 11,037,856 - Neugirg , et al. June 15, 2	2021-06-15
Flat Lead Package Formation Method App 20210043603 - Meyer; Thorsten ; et al.	2021-02-11
Semiconductor Chip Package Comprising Substrate, Semiconductor Chip, And Leadframe And A Method For Fabricating The Same App 20200251400 - Kind Code	2020-08-06
Multi-Purpose Non-Linear Semiconductor Package Assembly Line App 20200203310 - Meyer; Thorsten ; et al.	2020-06-25
Multi-purpose non-linear semiconductor package assembly line Grant 10,566,309 - Meyer , et al. Feb	2020-02-18
Semiconductor Chip Package Comprising Substrate, Semiconductor Chip, And Leadframe And A Method For Fabricating The Same App 20190103342 - NEUGIRG; Christian ; et al.	2019-04-04
Multi-Purpose Non-Linear Semiconductor Package Assembly Line App 20180096966 - Meyer; Thorsten ; et al.	2018-04-05
Method of forming a bondpad and bondpad Grant 9,780,053 - Hoier , et al. October 3, 2	2017-10-03
Electronic device and method of fabricating an electronic device Grant 9,756,726 - Heinrich , et al. September 5, 2	2017-09-05
Smart card module arrangement Grant 9,633,303 - Pueschner , et al. April 25, 2	2017-04-25
Electronic device and method for fabricating an electronic device Grant 9,355,984 - Escher-Poeppel , et al. May 31, 2	2016-05-31
Chip arrangement and a method for manufacturing a chip arrangement Grant 9,224,695 - Pueschner , et al. December 29, 2	2015-12-29
Smart card module for a smart card Grant 9,141,902 - Pueschner , et al. September 22, 2	2015-09-22
Electronic Device and Method of Fabricating an Electronic Device App 20150124420 - Heinrich; Alexander ; et al.	2015-05-07
Electronic Device And Method For Fabricating An Electronic Device App 20150021792 - Escher-Poeppel; Irmgard ; et al.	2015-01-22
Smart Card Module Arrangement App 20140263663 - Pueschner; Frank ; et al.	2014-09-18
Chip Arrangement And A Method For Manufacturing A Chip Arrangement App 20140239474 - Pueschner; Frank ; et al.	2014-08-28
Semiconductor Housing for Smart Cards App 20140091450 - Pueschner; Frank ; et al.	2014-04-03
Cover structure with integrated chip and antenna Grant 8,684,273 - Scherl , et al. April 1, 2	2014-04-01
Transponder inlay with antenna breaking layer for a document for personal identification, and a method for producing a transponder inlay Grant 8,640,961 - Gruenauer , et al. February 4, 2	2014-02-04
Smart Card Module for a Smart Card App 20130082112 - Pueschner; Frank ; et al.	2013-04-04
Cover Structure With Integrated Chip And Antenna App 20130075478 - Scherl; Peter ; et al.	2013-03-28
Document for personal identification having protection against external manipulations and a method for producing Grant 8,272,574 - Gruenauer , et al. September 25, 2	2012-09-25
Transponder Inlay For A Document For Personal Identification, And A Method For Producing A Transponder Inlay App 20120074228 - Gruenauer; Matthias ; et al.	2012-03-29
Document For Personal Identification And A Method For Producing A Document For Personal Identification App 20100084474 - Gruenauer; Matthias ; et al.	2010-04-08
Method For Arc Welding With Overlapped Band Electrodes Grant 3,751,628 - Scherl August 7, 1	1973-08-07

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