Schelhorn; Robert L.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Schelhorn; Robert L..The latest application filed is for "method for connecting a leadless chip carrier to a substrate".
- Schelhorn; Robert L. - Vincentown NJ
- Schelhorn; Robert L. - Cinnaminson NJ
| Patent | Date |
|---|---|
| Method for connecting a leadless chip carrier to a substrate Grant 5,001,829 - Schelhorn March 26, 1 | 1991-03-26 |
| Metallized ceramic circuit package Grant 4,967,315 - Schelhorn October 30, 1 | 1990-10-30 |
| Method of connecting surface mounted packages to a circuit board and the resulting connector Grant 4,417,296 - Schelhorn November 22, 1 | 1983-11-22 |
| Porcelain coated metal boards having interconnections between the face and reverse surfaces thereof Grant 4,393,438 - Schelhorn July 12, 1 | 1983-07-12 |
| Structure for mounting a semiconductor chip to a metal core substrate Grant 4,383,270 - Schelhorn May 10, 1 | 1983-05-10 |
| Method for the manufacture of porcelain coated metal boards having interconnections between the top and bottom surfaces Grant 4,328,614 - Schelhorn May 11, 1 | 1982-05-11 |
| Composite substrate Grant 4,296,272 - Schelhorn October 20, 1 | 1981-10-20 |
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