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Patent applications and USPTO patent grants for Scheifers; Steven M..The latest application filed is for "printed electronic component assembly enabled by low temperature processing".
Patent | Date |
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Method and apparatus for selectively patterning free standing quantum DOT (FSQDT) polymer composites Grant 7,989,153 - Skipor , et al. August 2, 2 | 2011-08-02 |
Printed Electronic Component Assembly Enabled By Low Temperature Processing App 20100085715 - Scheifers; Steven M. ;   et al. | 2010-04-08 |
Method And Apparatus For Selectively Patterning Free Standing Quantum Dot (fsqdt) Polymer Composites App 20090017268 - Skipor; Andrew F. ;   et al. | 2009-01-15 |
Microwave Removable Coating App 20080050515 - SCHEIFERS; STEVEN M. ;   et al. | 2008-02-28 |
Method for determining chemical content of complex structures using X-ray microanalysis Grant 7,197,110 - Riess , et al. March 27, 2 | 2007-03-27 |
Recycling compatible hard coating App 20070048526 - Hoffman; William F. III ;   et al. | 2007-03-01 |
High energy soldering composition and method of soldering App 20060196579 - Skipor; Andrew F. ;   et al. | 2006-09-07 |
Method for determining chemical content of complex structures using X-ray microanalysis App 20060115042 - Riess; Michael ;   et al. | 2006-06-01 |
Method and chemistry for automatic self-joining of failures in polymers Grant 6,858,660 - Scheifers , et al. February 22, 2 | 2005-02-22 |
Method And Chemistry For Automatic Self-joining Of Failures In Polymers App 20050027078 - Scheifers, Steven M. ;   et al. | 2005-02-03 |
Microwave removable coating App 20040249042 - Scheifers, Steven M. ;   et al. | 2004-12-09 |
Organic semiconductor device having an oxide layer Grant 6,677,607 - Scheifers , et al. January 13, 2 | 2004-01-13 |
Microelectronic assembly with die support and method App 20040002181 - Scheifers, Steven M. ;   et al. | 2004-01-01 |
Organic semiconductor and method Grant 6,603,141 - Lach , et al. August 5, 2 | 2003-08-05 |
Organic semiconductor device and method App 20030141524 - Scheifers, Steven M. ;   et al. | 2003-07-31 |
Organic Semiconductor And Method App 20030122119 - Lach, Lawrence E. ;   et al. | 2003-07-03 |
Microelectronic assembly with die support and method Grant 6,562,663 - Scheifers , et al. May 13, 2 | 2003-05-13 |
Microelectronic assembly with die support and method App 20020142514 - Scheifers, Steven M. ;   et al. | 2002-10-03 |
Method for forming a thick-film resistor and thick-film resistor formed thereby Grant 6,229,098 - Dunn , et al. May 8, 2 | 2001-05-08 |
Method for forming a thick-film resistor and thick-film resistor formed thereby Grant 6,171,921 - Dunn , et al. January 9, 2 | 2001-01-09 |
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