Schary; Timo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Schary; Timo.The latest application filed is for "micromechanical oscillation system".

Company Profile

3.6.16

Schary; Timo - Aichtal-Neuenhaus DE
Schary; Timo - Bremen DE
SCHARY; Timo - Reutlingen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Micromechanical Oscillation System App 20220283427 - Tanguep Njiokep; Eugene Moliere ; et al.	2022-09-08
Semiconductor Component Including A Dielectric Layer App 20220238791 - Monteiro Diniz Reis; Daniel ; et al.	2022-07-28
Semiconductor Component Including A Dielectric Layer App 20220231219 - Monteiro Diniz Reis; Daniel ; et al.	2022-07-21
Micromechanical Oscillation System App 20220214536 - Grutzeck; Helmut ; et al.	2022-07-07
Method And Device For Using A Semiconductor Component App 20220216298 - Monteiro Diniz Reis; Daniel ; et al.	2022-07-07
Micromechanical micromirror array and corresponding operating method Grant 11,307,404 - Grutzeck , et al. April 19, 2	2022-04-19
Microelectronics Device And Method For Producing A Microelectronics Device App 20210328524 - Tomaschko; Jochen ; et al.	2021-10-21
Micromechanical Component And Method For Producing A Micromechanical Component App 20210271073 - Eberspaecher; Alexander ; et al.	2021-09-02
Electrical Contacting And Method For Producing An Electrical Contacting App 20210261404 - Reinmuth; Jochen ; et al.	2021-08-26
Micromechanical Micromirror Array And Corresponding Operating Method App 20200249467 - Kind Code	2020-08-06
Method for producing at least one via in a wafer Grant 10,643,896 - Stahl , et al.	2020-05-05
Method for Producing at least One Via in a Wafer App 20190096762 - Stahl; Heiko ; et al.	2019-03-28
Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates Grant 9,123,716 - Gonska , et al. September 1, 2	2015-09-01
Component having through-hole plating, and method for its production Grant 9,035,432 - Reinmuth , et al. May 19, 2	2015-05-19
Component Having Through-hole Plating, And Method For Its Production App 20130341766 - REINMUTH; Jochen ; et al.	2013-12-26
Micromechanical Component And Method For Manufacturing A Micromechanical Component App 20130285175 - Gonska; Julian ; et al.	2013-10-31
Method For Bonding Two Silicon Substrates, And A Correspondeing System Of Two Silicon Substrates App 20130161820 - GONSKA; Julian ; et al.	2013-06-27

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.