Schaper; Leonard W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Schaper; Leonard W..The latest application filed is for "structure and process for packaging rf mems and other devices".

Company Profile

0.15.10

Schaper; Leonard W. - Fayetteville AR
Schaper, Leonard W. - Fayeteville AR
Schaper; Leonard W. - Berkeley Heights NJ
Schaper; Leonard W. - West Orange NJ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure and process for packaging RF MEMS and other devices App 20060211177 - Schaper; Leonard W. ; et al.	2006-09-21
Method of packaging RF MEMS Grant 7,049,175 - Schaper , et al. May 23, 2	2006-05-23
RC terminator and production method therefor Grant 7,005,722 - Schaper , et al. February 28, 2	2006-02-28
Structure and process for packaging rf mems and other devices App 20050006738 - Schaper, Leonard W. ; et al.	2005-01-13
Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methods Grant 6,806,568 - Schaper October 19, 2	2004-10-19
Apparatus and method for providing low-loss transmission lines in interconnected mesh plane systems Grant 6,800,939 - Schaper October 5, 2	2004-10-05
Surface applied passives Grant 6,707,680 - Schaper March 16, 2	2004-03-16
Method of forming capacitor with extremely wide band low impedance App 20040016094 - Schaper, Leonard W.	2004-01-29
Apparatus and method for providing low-loss transmission lines in interconnected mesh plane systems App 20030222288 - Schaper, Leonard W.	2003-12-04
Rc terminator and production method therefor App 20030057518 - Schaper, Leonard W. ; et al.	2003-03-27
Method of making capacitor with extremely wide band low impedance Grant 6,516,504 - Schaper February 11, 2	2003-02-11
Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methods App 20030015783 - Schaper, Leonard W.	2003-01-23
Surface applied passives App 20020131254 - Schaper, Leonard W.	2002-09-19
Electronic interconnection medium having offset electrical mesh plane Grant 6,388,200 - Schaper May 14, 2	2002-05-14
Floating Plate Capacitor With Extremely Wide Band Low Impedance App 20020027763 - SCHAPER, LEONARD W.	2002-03-07
Electronic interconnection medium having offset electrical mesh plane App 20010047588 - Schaper, Leonard W.	2001-12-06
Multichip module and method of forming same Grant 6,297,460 - Schaper October 2, 2	2001-10-02
Electronic interconnection medium having offset electrical mesh plane App 20010013422 - Schaper, Leonard W.	2001-08-16
Floating plate capacitor with extremely wide band low impedance Grant 6,272,003 - Schaper August 7, 2	2001-08-07
Electronic interconnection medium having offset electrical mesh plane Grant 6,255,600 - Schaper July 3, 2	2001-07-03
Method of electroplating a substrate, and products made thereby Grant 5,873,992 - Glezen , et al. February 23, 1	1999-02-23
Method of planarizing polycrystalline diamonds, planarized polycrystalline diamonds and products made therefrom Grant 5,472,370 - Malshe , et al. December 5, 1	1995-12-05
Optical fiber switch Grant 4,896,937 - Kraetsch , et al. January 30, 1	1990-01-30
Water-scale-integrated assembly Grant 4,675,717 - Herrero , et al. June 23, 1	1987-06-23
Low-inductance power/ground distribution in a package for a semiconductor chip Grant 4,577,214 - Schaper March 18, 1	1986-03-18

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