Schaffer; Christopher P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Schaffer; Christopher P..The latest application filed is for "modular electronic header assembly and methods of manufacture".
- Schaffer; Christopher P. - Fallbrook CA US
- Schaffer; Christopher P. - Long Beach CA
- Schaffer; Christopher P - Long Beach CA
| Patent | Date |
|---|---|
| Wire-less inductive devices and methods Grant 8,860,543 - Schaffer , et al. October 14, 2 | 2014-10-14 |
| Modular electronic header assembly and methods of manufacture Grant 8,845,367 - Gutierrez , et al. September 30, 2 | 2014-09-30 |
| Simplified inductive devices and methods Grant 8,754,734 - Schaffer , et al. June 17, 2 | 2014-06-17 |
| Modular Electronic Header Assembly And Methods Of Manufacture App 20140036459 - Gutierrez; Aurelio J. ; et al. | 2014-02-06 |
| Substrate-based Inductive Devices And Methods Of Using And Manufacturing The Same App 20130323974 - Gutierrez; Aurelio J. ; et al. | 2013-12-05 |
| Substrate inductive devices and methods Grant 8,591,262 - Schaffer , et al. November 26, 2 | 2013-11-26 |
| Substrate Inductive Devices And Methods App 20130033353 - Schaffer; Christopher P. ; et al. | 2013-02-07 |
| Substrate inductive devices and methods Grant 8,234,778 - Schaffer , et al. August 7, 2 | 2012-08-07 |
| Substrate Inductive Devices And Methods App 20120058676 - Schaffer; Christopher P. ; et al. | 2012-03-08 |
| Power-enabled connector assembly and method of manufacturing Grant 8,118,619 - Schaffer , et al. February 21, 2 | 2012-02-21 |
| Substrate Inductive Devices And Methods App 20120011709 - Schaffer; Christopher P. ; et al. | 2012-01-19 |
| Simplified Inductive Devices And Methods App 20110193669 - Schaffer; Christopher P. ; et al. | 2011-08-11 |
| Substrate inductive devices and methods Grant 7,982,572 - Schaffer , et al. July 19, 2 | 2011-07-19 |
| Modular electronic header assembly and methods of manufacture Grant 7,942,700 - Gutierrez , et al. May 17, 2 | 2011-05-17 |
| Power-enabled Connector Assembly And Method Of Manufacturing App 20110074213 - Schaffer; Christopher P. ; et al. | 2011-03-31 |
| Power-enabled connector assembly and method of manufacturing Grant 7,845,984 - Schaffer , et al. December 7, 2 | 2010-12-07 |
| Modular Electronic Header Assembly And Methods Of Manufacture App 20100284160 - Gutierrez; Aurelio J. ; et al. | 2010-11-11 |
| High power MCM package with improved planarity and heat dissipation Grant 7,745,257 - Schaffer June 29, 2 | 2010-06-29 |
| Connector keep-out apparatus and methods Grant 7,708,602 - Rascon , et al. May 4, 2 | 2010-05-04 |
| Substrate Inductive Devices And Methods App 20100013589 - Schaffer; Christopher P. ; et al. | 2010-01-21 |
| Power-enabled Connector Assembly And Method Of Manufacturing App 20100009576 - Schaffer; Christopher P. ; et al. | 2010-01-14 |
| High Power Mcm Package With Improved Planarity And Heat Dissipation App 20090035896 - Schaffer; Christopher P. | 2009-02-05 |
| High power MCM package with improved planarity and heat dissipation Grant 7,453,146 - Schaffer November 18, 2 | 2008-11-18 |
| Connector keep-out apparatus and methods App 20080220657 - Rascon; Thomas ; et al. | 2008-09-11 |
| Wire-less inductive devices and methods App 20080186124 - Schaffer; Christopher P. ; et al. | 2008-08-07 |
| Test arrangement including anisotropic conductive film for testing power module Grant 7,355,431 - Schaffer , et al. April 8, 2 | 2008-04-08 |
| Semiconductor device module with flip chip devices on a common lead frame Grant 7,301,235 - Schaffer , et al. November 27, 2 | 2007-11-27 |
| Power semiconductor package App 20060202320 - Schaffer; Christopher P. | 2006-09-14 |
| Semiconductor device module with flip chip devices on a common lead frame App 20050280163 - Schaffer, Christopher P. ; et al. | 2005-12-22 |
| High power MCM package with improved planarity and heat dissipation App 20050275112 - Schaffer, Christopher P. | 2005-12-15 |
| Test arrangement including anisotropic conductive film for testing power module App 20050270057 - Schaffer, Christopher P. ; et al. | 2005-12-08 |
| High power MCM package Grant 6,946,740 - Schaffer September 20, 2 | 2005-09-20 |
| High power MCM package App 20040061221 - Schaffer, Christopher P. | 2004-04-01 |
| Microelectronic device structure with metallic interlayer between substrate and die Grant 6,534,792 - Schaffer March 18, 2 | 2003-03-18 |
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