loadpatents
Patent applications and USPTO patent grants for Schaefer; Louis Paul.The latest application filed is for "low density coring material".
Patent | Date |
---|---|
Low density coring material Grant 10,214,618 - Adams , et al. Feb | 2019-02-26 |
Complete tooling packages for mold building structures Grant 10,112,323 - Lake , et al. October 30, 2 | 2018-10-30 |
Low Density Coring Material App 20170058084 - Adams; Robert Mark ;   et al. | 2017-03-02 |
Low density coring material Grant 9,511,563 - Adams , et al. December 6, 2 | 2016-12-06 |
Complete Tooling Packages For Mold Building Structures App 20120295019 - Lake; Randall ;   et al. | 2012-11-22 |
High Build Low Temperature Exotherm Extrudable Material App 20120135147 - Twardowska; Helena ;   et al. | 2012-05-31 |
Low Density Coring Material App 20120040173 - Adams; Robert Mark ;   et al. | 2012-02-16 |
Low Density Coring Material App 20120040174 - Adams; Robert Mark ;   et al. | 2012-02-16 |
Method of making a sheet of building material App 20030057594 - Anderson, Robert Phillip ;   et al. | 2003-03-27 |
Wood Replacement System And Method App 20020166495 - Anderson, Robert Phillip ;   et al. | 2002-11-14 |
Wood replacement system and method Grant 6,463,871 - Anderson , et al. October 15, 2 | 2002-10-15 |
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