Schad; Alfred
Patent Applications and Registrations
Patent applications and USPTO patent grants for Schad; Alfred.The latest application filed is for "thermoformed package with integrated predetermined breaking points, and a process for the production thereof".
- Schad; Alfred - Wiesbaden DE
| Patent | Date |
|---|---|
| Thermoformed package with integrated predetermined breaking points, and a process for the production thereof Grant 5,820,953 - Beer , et al. October 13, 1 | 1998-10-13 |
| Cup-like package with cover film of plastic Grant 5,392,986 - Beer , et al. February 28, 1 | 1995-02-28 |
| Plastic pipe having an oxygen-impermeable casing Grant 4,593,853 - Schad , et al. June 10, 1 | 1986-06-10 |
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