Scarsella; Michael

Patent Applications and Registrations

Patent applications and USPTO patent grants for Scarsella; Michael.The latest application filed is for "ultrasonic matrix array probe with thermally dissipating cable and backing block heat exchange".

Company Profile

1.4.4

Scarsella; Michael - Eindhoven NL
Scarsella; Michael - Amesbury MA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Robust ultrasound transducer probes having protected integrated circuit interconnects Grant 11,231,491 - Scarsella , et al. January 25, 2	2022-01-25
Ultrasonic matrix array probe with thermally dissipating cable and backing block heat exchange Grant 10,178,986 - Davidsen , et al. Ja	2019-01-15
Ultrasonic Matrix Array Probe With Thermally Dissipating Cable And Backing Block Heat Exchange App 20180125463 - Davidsen; Richard Edward ; et al.	2018-05-10
Ultrasonic matrix array probe with thermally dissipating cable and backing block heat exchange Grant 9,872,669 - Davidsen , et al. January 23, 2	2018-01-23
Acoustic probe with components of acoustic elements having different pitches than each other Grant 9,689,973 - Savord , et al. June 27, 2	2017-06-27
Robust Ultrasound Transducer Probes Having Protected Integrated Circuit Interconnects App 20160282455 - SCARSELLA; Michael ; et al.	2016-09-29
Acoustic Probe With Components Of Acoustic Elements Having Different Pitches Than Each Other App 20150338511 - SAVORD; Bernard Joseph ; et al.	2015-11-26
Ultrasonic Matrix Array Probe With Thermally Dissipating Cable And Backing Block Heat Exchange App 20150099978 - Davidsen; Richard Edward ; et al.	2015-04-09

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