Scanlan; Christopher M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Scanlan; Christopher M..The latest application filed is for "fully molded semiconductor package for power devices and method of making the same".
Company Profile
8.63.43
- Scanlan; Christopher M. - Chandler AZ
- Scanlan; Christopher M. - Hellerup DK
- Scanlan; Christopher M. - Phoenix AZ
Patent Activity
| Patent | Date |
|---|---|
| Fully molded semiconductor package for power devices and method of making the same Grant 10,818,635 - Olson , et al. October 27, 2 | 2020-10-27 |
| Thermally enhanced fully molded fan-out module Grant 10,720,417 - Scanlan | 2020-07-21 |
| Method of making fully molded peripheral package on package device Grant 10,672,624 - Scanlan , et al. | 2020-06-02 |
| Semiconductor device and method of unit specific progressive alignment Grant 10,573,601 - Scanlan , et al. Feb | 2020-02-25 |
| Fully Molded Semiconductor Package For Power Devices And Method Of Making The Same App 20190326255 - Olson; Timothy L. ; et al. | 2019-10-24 |
| Method of marking a semiconductor package Grant 10,373,913 - Scanlan | 2019-08-06 |
| Fully molded miniaturized semiconductor module Grant 10,373,902 - Scanlan , et al. | 2019-08-06 |
| Semiconductor device and method of packaging Grant 10,373,870 - Scanlan , et al. | 2019-08-06 |
| Semiconductor Device And Method Of Unit Specific Progressive Alignment App 20190139901 - Scanlan; Christopher M. ; et al. | 2019-05-09 |
| Semiconductor device and method of unit specific progressive alignment Grant 10,157,803 - Bishop , et al. Dec | 2018-12-18 |
| Fully Molded Peripheral Package On Package Device App 20180330966 - Scanlan; Christopher M. ; et al. | 2018-11-15 |
| Thermally Enhanced Fully Molded Fan-out Module App 20180261586 - Scanlan; Christopher M. | 2018-09-13 |
| Semiconductor Device And Method Of Packaging App 20180254216 - Scanlan; Christopher M. ; et al. | 2018-09-06 |
| Automated optical inspection of unit specific patterning Grant 10,056,304 - Bishop , et al. August 21, 2 | 2018-08-21 |
| Fully molded peripheral package on package device Grant 10,050,004 - Scanlan , et al. August 14, 2 | 2018-08-14 |
| Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping Grant 9,978,655 - Scanlan , et al. May 22, 2 | 2018-05-22 |
| Fully Molded Miniaturized Semiconductor Module App 20180108606 - Scanlan; Christopher M. ; et al. | 2018-04-19 |
| Semiconductor Device And Method Of Unit Specific Progressive Alignment App 20180082911 - Bishop; Craig ; et al. | 2018-03-22 |
| Semiconductor device and method of adaptive patterning for panelized packaging Grant 9,887,103 - Scanlan , et al. February 6, 2 | 2018-02-06 |
| Thermally Enhanced Fully Molded Fan-out Module App 20180012881 - Scanlan; Christopher M. | 2018-01-11 |
| Semiconductor Device And Method Comprising Redistribution Layers App 20170372964 - Scanlan; Christopher M. ; et al. | 2017-12-28 |
| Fully molded miniaturized semiconductor module Grant 9,831,170 - Scanlan , et al. November 28, 2 | 2017-11-28 |
| Semiconductor package in package Grant 9,768,124 - Scanlan , et al. September 19, 2 | 2017-09-19 |
| Thermally enhanced fully molded fan-out module Grant 9,761,571 - Scanlan September 12, 2 | 2017-09-12 |
| Automated Optical Inspection Of Unit Specific Patterning App 20170256466 - Bishop; Craig ; et al. | 2017-09-07 |
| Semiconductor device and method comprising redistribution layers Grant 9,754,835 - Scanlan , et al. September 5, 2 | 2017-09-05 |
| Fully Molded Peripheral Package On Package Device App 20170221830 - Scanlan; Christopher M. ; et al. | 2017-08-03 |
| Method Of Marking A Semiconductor Package App 20170186696 - Scanlan; Christopher M. | 2017-06-29 |
| Fully Molded Peripheral Package On Package Device App 20170148755 - Scanlan; Christopher M. ; et al. | 2017-05-25 |
| Fully molded peripheral package on package device Grant 9,613,830 - Scanlan , et al. April 4, 2 | 2017-04-04 |
| Method of marking a semiconductor package Grant 9,613,912 - Scanlan April 4, 2 | 2017-04-04 |
| Thermally Enhanced Fully Molded Fan-out Module App 20170084596 - Scanlan; Christopher M. | 2017-03-23 |
| Fully Molded Miniaturized Semiconductor Module App 20170077022 - Scanlan; Christopher M. ; et al. | 2017-03-16 |
| Semiconductor device and method comprising redistribution layers Grant 9,576,919 - Scanlan , et al. February 21, 2 | 2017-02-21 |
| Semiconductor Device And Method Comprising Redistribution Layers App 20170033009 - Scanlan; Christopher M. ; et al. | 2017-02-02 |
| Semiconductor Package In Package App 20160379933 - Scanlan; Christopher M. ; et al. | 2016-12-29 |
| Front side package-level serialization for packages comprising unique identifiers Grant 9,520,364 - Bishop , et al. December 13, 2 | 2016-12-13 |
| Adaptive patterning for panelized packaging Grant 9,520,331 - Scanlan , et al. December 13, 2 | 2016-12-13 |
| 3D interconnect component for fully molded packages Grant 9,502,397 - Scanlan November 22, 2 | 2016-11-22 |
| Automated Optical Inspection Of Unit Specific Patterning App 20160336241 - Bishop; Craig ; et al. | 2016-11-17 |
| Semiconductor Device And Method Of Adaptive Patterning For Panelized Packaging With Dynamic Via Clipping App 20160329257 - Scanlan; Christopher M. ; et al. | 2016-11-10 |
| 3d Interconnect Component For Fully Molded Packages App 20160322343 - Scanlan; Christopher M. | 2016-11-03 |
| Semiconductor package in package Grant 9,466,545 - Scanlan , et al. October 11, 2 | 2016-10-11 |
| Magnetically sealed wafer plating jig system and method Grant 9,464,362 - Scanlan , et al. October 11, 2 | 2016-10-11 |
| Fully Molded Peripheral Package On Package Device App 20160260682 - Scanlan; Christopher M. ; et al. | 2016-09-08 |
| Adaptive patterning for panelized packaging Grant 9,418,905 - Olson , et al. August 16, 2 | 2016-08-16 |
| Automated optical inspection of unit specific patterning Grant 9,401,313 - Bishop , et al. July 26, 2 | 2016-07-26 |
| Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping Grant 9,397,069 - Scanlan , et al. July 19, 2 | 2016-07-19 |
| Method Of Marking A Semiconductor Package App 20160172306 - Scanlan; Christopher M. | 2016-06-16 |
| Automated Optical Inspection Of Unit Specific Patterning App 20160141213 - Bishop; Craig ; et al. | 2016-05-19 |
| Die up fully molded fan-out wafer level packaging Grant 9,337,086 - Scanlan May 10, 2 | 2016-05-10 |
| Semiconductor Device And Method Comprising Redistribution Layers App 20160093580 - Scanlan; Christopher M. ; et al. | 2016-03-31 |
| Semiconductor Device And Method Of Adaptive Patterning For Panelized Packaging App 20160086825 - Scanlan; Christopher M. ; et al. | 2016-03-24 |
| Front Side Package-level Serialization For Packages Comprising Unique Identifiers App 20160064334 - Bishop; Craig ; et al. | 2016-03-03 |
| Semiconductor device and method of land grid array packaging with bussing lines Grant 9,269,622 - Scanlan , et al. February 23, 2 | 2016-02-23 |
| Semiconductor Device And Method Of Adaptive Patterning For Panelized Packaging With Dynamic Via Clipping App 20150364444 - Scanlan; Christopher M. ; et al. | 2015-12-17 |
| Semiconductor device and method of adaptive patterning for panelized packaging Grant 9,196,509 - Scanlan , et al. November 24, 2 | 2015-11-24 |
| Semiconductor device and method comprising thickened redistribution layers Grant 9,177,926 - Scanlan , et al. November 3, 2 | 2015-11-03 |
| Semiconductor Device And Method Comprising Thickened Redistribution Layers App 20150187710 - Scanlan; Christopher M. ; et al. | 2015-07-02 |
| Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping Grant 9,040,316 - Scanlan , et al. May 26, 2 | 2015-05-26 |
| Die Up Fully Molded Fan-out Wafer Level Packaging App 20150115456 - Scanlan; Christopher M. | 2015-04-30 |
| Die up fully molded fan-out wafer level packaging Grant 8,922,021 - Scanlan December 30, 2 | 2014-12-30 |
| Semiconductor Device And Method Of Land Grid Array Packaging With Bussing Lines App 20140335658 - Scanlan; Christopher M. ; et al. | 2014-11-13 |
| Fully molded fan-out Grant 8,835,230 - Scanlan September 16, 2 | 2014-09-16 |
| Adaptive patterning for panelized packaging Grant 8,826,221 - Scanlan , et al. September 2, 2 | 2014-09-02 |
| Panelized Packaging With Transferred Dielectric App 20140225271 - Scanlan; Christopher M. | 2014-08-14 |
| Adaptive patterning for panelized packaging Grant 8,799,845 - Scanlan , et al. August 5, 2 | 2014-08-05 |
| Fan out build up substrate stackable package and method Grant 8,796,561 - Scanlan , et al. August 5, 2 | 2014-08-05 |
| Magnetically Sealed Wafer Plating Jig System And Method App 20140024178 - Scanlan; Christopher M. ; et al. | 2014-01-23 |
| Stacked redistribution layer (RDL) die assembly package Grant 8,629,546 - Scanlan January 14, 2 | 2014-01-14 |
| Die Up Fully Molded Fan-out Wafer Level Packaging App 20140008809 - Scanlan; Christopher M. | 2014-01-09 |
| Fully molded fan-out Grant 8,604,600 - Scanlan December 10, 2 | 2013-12-10 |
| Adaptive Patterning For Panelized Packaging App 20130280826 - Scanlan; Christopher M. ; et al. | 2013-10-24 |
| Adaptive Patterning For Panelized Packaging App 20130249088 - Scanlan; Christopher M. ; et al. | 2013-09-26 |
| Fully Molded Fan-out App 20130244376 - Scanlan; Christopher M. | 2013-09-19 |
| Adaptive Patterning For Panelized Packaging App 20130241074 - Scanlan; Christopher M. ; et al. | 2013-09-19 |
| Die up fully molded fan-out wafer level packaging Grant 8,535,978 - Scanlan September 17, 2 | 2013-09-17 |
| Die Up Fully Molded Fan-out Wafer Level Packaging App 20130168874 - Scanlan; Christopher M. | 2013-07-04 |
| Fully Molded Fan-Out App 20130168849 - Scanlan; Christopher M. | 2013-07-04 |
| Adaptive Patterning For Panelized Packaging App 20130167102 - Olson; Timothy L. ; et al. | 2013-06-27 |
| Thin stacked interposer package Grant 8,319,338 - Berry , et al. November 27, 2 | 2012-11-27 |
| Semiconductor device having RF shielding and method therefor Grant 8,299,610 - Berry , et al. October 30, 2 | 2012-10-30 |
| Stacked redistribution layer (RDL) die assembly package Grant 8,203,203 - Scanlan June 19, 2 | 2012-06-19 |
| Panelized Packaging With Transferred Dielectric App 20110198762 - Scanlan; Christopher M. | 2011-08-18 |
| Adaptive Patterning For Panelized Packaging App 20110202896 - Scanlan; Christopher M. ; et al. | 2011-08-18 |
| Thermal via heat spreader package and method Grant 7,960,827 - Miller, Jr. , et al. June 14, 2 | 2011-06-14 |
| Semiconductor device having EMI shielding and method therefor Grant 7,898,066 - Scanlan , et al. March 1, 2 | 2011-03-01 |
| Exposed metal bezel for use in sensor devices and method therefor Grant 7,859,116 - Kelly , et al. December 28, 2 | 2010-12-28 |
| System and method for shielding of package on package (PoP) assemblies Grant 7,851,894 - Scanlan December 14, 2 | 2010-12-14 |
| Stackable semiconductor package including laminate interposer Grant 7,829,990 - Scanlan , et al. November 9, 2 | 2010-11-09 |
| Stacked redistribution layer (RDL) die assembly package Grant 7,825,520 - Longo , et al. November 2, 2 | 2010-11-02 |
| Membrane die attach circuit element package and method therefor Grant 7,781,852 - Faheem , et al. August 24, 2 | 2010-08-24 |
| Thin stacked interposer package Grant 7,777,351 - Berry , et al. August 17, 2 | 2010-08-17 |
| Semiconductor device having RF shielding and method therefor Grant 7,745,910 - Olson , et al. June 29, 2 | 2010-06-29 |
| Etch singulated semiconductor package Grant 7,732,899 - Berry , et al. June 8, 2 | 2010-06-08 |
| Stacked redistribution layer (RDL) die assembly package Grant 7,550,857 - Longo , et al. June 23, 2 | 2009-06-23 |
| Etch singulated semiconductor package Grant 7,507,603 - Berry , et al. March 24, 2 | 2009-03-24 |
| Semiconductor device having RF shielding and method therefor Grant 7,342,303 - Berry , et al. March 11, 2 | 2008-03-11 |
| Electronic component Grant 5,898,128 - Romero , et al. April 27, 1 | 1999-04-27 |
| Semiconductor device balancing thermal expansion coefficient mismatch Grant 5,751,552 - Scanlan , et al. May 12, 1 | 1998-05-12 |
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