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Patent applications and USPTO patent grants for Saxenmeyer, Jr.; George J..The latest application filed is for "high density connector".
Patent | Date |
---|---|
High density connector Grant 5,248,262 - Busacco , et al. September 28, 1 | 1993-09-28 |
Method of forming a conductive end portion on a flexible circuit member Grant 5,237,743 - Busacco , et al. August 24, 1 | 1993-08-24 |
Electrical assembly with flexible circuit Grant 5,199,879 - Kohn , et al. April 6, 1 | 1993-04-06 |
Method of fabricating nendritic materials Grant 5,185,073 - Bindra , et al. February 9, 1 | 1993-02-09 |
Separable electrical connection technology Grant 5,137,461 - Bindra , et al. August 11, 1 | 1992-08-11 |
Restorable backbond for LSI chips using liquid metal coated dendrites Grant 4,254,431 - Babuka , et al. March 3, 1 | 1981-03-03 |
Process for the electrodeposition of ductile palladium and electroplating bath useful therefor Grant 3,920,526 - Caricchio, Jr. , et al. November 18, 1 | 1975-11-18 |
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