Sawle; Andrew

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sawle; Andrew.The latest application filed is for "methods of producing inductor modules and power semiconductor systems having inductor modules".

Company Profile

5.7.8

Sawle; Andrew - East Grinstead GB
Sawle; Andrew - Copthorne GB
Sawle; Andrew - West Sussex N/A GB

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods Of Producing Inductor Modules And Power Semiconductor Systems Having Inductor Modules App 20210036610 - Palm; Petteri ; et al.	2021-02-04
Methods of manufacturing inductor modules and power semiconductor systems having inductor modules Grant 10,833,583 - Palm , et al. November 10, 2	2020-11-10
Methods of Manufacturing Inductor Modules and Power Semiconductor Systems Having Inductor Modules App 20200212798 - Palm; Petteri ; et al.	2020-07-02
Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules Grant 10,601,314 - Palm , et al.	2020-03-24
Power Semiconductor Systems Having Inductor Modules, and Methods of Manufacturing Inductor Modules and Power Semiconductor Systems Having Inductor Modules App 20190081562 - Palm; Petteri ; et al.	2019-03-14
Method for forming a reliable solderable contact Grant 9,852,940 - Standing , et al. December 26, 2	2017-12-26
Solderable contact and passivation for semiconductor dies Grant 9,852,939 - Standing , et al. December 26, 2	2017-12-26
Solderable Contact and Passivation for Semiconductor Dies App 20130140701 - Standing; Martin ; et al.	2013-06-06
Method for Forming a Reliable Solderable Contact App 20130143399 - Standing; Martin ; et al.	2013-06-06
Solderable top metalization and passivation for source mounted package Grant 8,368,211 - Standing , et al. February 5, 2	2013-02-05
Semiconductor package fabrication Grant 7,402,507 - Standing , et al. July 22, 2	2008-07-22
Semiconductor package fabrication App 20060205112 - Standing; Martin ; et al.	2006-09-14
Preparation of front contact for surface mounting App 20050269677 - Standing, Martin ; et al.	2005-12-08
Solderable top metalization and passivation for source mounted package App 20050200011 - Standing, Martin ; et al.	2005-09-15

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