Sawasaki; Kouichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sawasaki; Kouichi.The latest application filed is for "polyimide film".
- Sawasaki; Kouichi - Nagoya N/A JP
- Sawasaki; Kouichi - Aichi JP
| Patent | Date |
|---|---|
| Polyimide film Grant 8,445,099 - Sawasaki , et al. May 21, 2 | 2013-05-21 |
| Polyimide Film App 20110293910 - SAWASAKI; KOUICHI ; et al. | 2011-12-01 |
| Copper Clad Laminate App 20090017286 - Maeda; Meguru ; et al. | 2009-01-15 |
| Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate Grant 6,908,685 - Uhara , et al. June 21, 2 | 2005-06-21 |
| Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate App 20040010113 - Uhara, Kenji ; et al. | 2004-01-15 |
| Polyimide film, method of manufacture , and metal interconnect board with Polyimide film substrate App 20020045033 - Uhara, Kenji ; et al. | 2002-04-18 |
| Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate App 20020045054 - Uhara, Kenji ; et al. | 2002-04-18 |
| Polyimide copolymer, polyimide copolymer resin molded products and their preparation Grant 5,859,171 - Sawasaki , et al. January 12, 1 | 1999-01-12 |
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