Sawamura; Yasushi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sawamura; Yasushi.The latest application filed is for "plastic optical fiber and plastic optical fiber cord".

Company Profile

0.7.3

Sawamura; Yasushi - Otsu JP
Sawamura; Yasushi - Otsu-shi JP
Sawamura; Yasushi - Shiga JP
Sawamura; Yasushi - Nagoya JP
Sawamura; Yasushi - Aichi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Plastic optical fiber and plastic optical fiber cord Grant 11,287,566 - Matsuba , et al. March 29, 2	2022-03-29
Plastic Optical Fiber And Plastic Optical Fiber Cord App 20200408985 - Matsuba; Satoshi ; et al.	2020-12-31
Adhesive composition for electronic components, and adhesive sheet for electronic components using the same Grant 8,138,580 - Konishi , et al. March 20, 2	2012-03-20
Adhesive Composition For Electronic Components, And Adhesive Sheet For Electronic Components Using The Same App 20100193961 - Konishi; Yukitsuna ; et al.	2010-08-05
Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate and semiconductor device Grant 6,716,529 - Sawamura , et al. April 6, 2	2004-04-06
Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate, and semiconductor device App 20020025431 - Sawamura, Yasushi ; et al.	2002-02-28
Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device Grant 6,303,219 - Sawamura , et al. October 16, 2	2001-10-16
Semiconductor element sealed with an epoxy resin compound Grant 5,985,455 - Tokunaga , et al. November 16, 1	1999-11-16
Semiconductor device-encapsulating epoxy resin composition containing secondary amino functional coupling agents Grant 5,476,884 - Kayaba , et al. December 19, 1	1995-12-19
Semiconductor device-encapsulating epoxy resin composition Grant 5,360,837 - Honda , et al. November 1, 1	1994-11-01

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