Sawai, Takami
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sawai, Takami.The latest application filed is for "powdery mold-releasing lubricant for use in casting with a mold and a mold casting method".
- Sawai, Takami - Osaka JP
| Patent | Date |
|---|---|
| Powdery mold-releasing lubricant for use in casting with a mold and a mold casting method App 20020022580 - Fukunaga, Hideharu ; et al. | 2002-02-21 |
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