Sawai; Keiichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sawai; Keiichi.The latest application filed is for "semiconductor device and manufacturing method for semiconductor device".
- Sawai; Keiichi - Sakai JP
- SAWAI; KEIICHI - Sakai City Osaka
- SAWAI; KEIICHI - Sakai-shi JP
- SAWAI; KEIICHI - Osaka JP
- Sawai; Keiichi - Osaka-shi JP
- Sawai; Keiichi - Fukuyama JP
- SAWAI; Keiichi - Fukuyama-shi JP
- Sawai; Keiichi - Hiroshima JP
| Patent | Date |
|---|---|
| Semiconductor device and manufacturing method for semiconductor device Grant 11,342,308 - Sawai May 24, 2 | 2022-05-24 |
| Bonding equipment Grant 11,145,618 - Iguchi , et al. October 12, 2 | 2021-10-12 |
| Semiconductor Device And Manufacturing Method For Semiconductor Device App 20210134758 - SAWAI; KEIICHI | 2021-05-06 |
| Light-emitting element module Grant 10,797,032 - Ikawa , et al. October 6, 2 | 2020-10-06 |
| Light-emitting Element Module App 20190333902 - IKAWA; YUTA ; et al. | 2019-10-31 |
| Bonding Equipment App 20190279956 - IGUCHI; KATSUJI ; et al. | 2019-09-12 |
| Mounting method for semiconductor light emitter using resist with openings of different sizes Grant 9,048,407 - Koyama , et al. June 2, 2 | 2015-06-02 |
| Mounting Method For Semiconductor Light Emitter App 20130065331 - Koyama; Yasuhiro ; et al. | 2013-03-14 |
| Semiconductor device and manufacturing method thereof Grant 7,605,057 - Shimoyama , et al. October 20, 2 | 2009-10-20 |
| Method For Producing A Semiconductor Device App 20090149014 - NIE; Norimitsu ; et al. | 2009-06-11 |
| Gold Plating Liquid And Gold Plating Method App 20090038957 - Sakakihara; Toshiaki ; et al. | 2009-02-12 |
| Etching liquid Grant 7,473,380 - Suzuki , et al. January 6, 2 | 2009-01-06 |
| Semiconductor device and manufacturing method thereof App 20080032485 - Shimoyama; Akio ; et al. | 2008-02-07 |
| Method of etching semiconductor device App 20070145003 - Suzuki; Yoshihide ; et al. | 2007-06-28 |
| Micro-hole plating method, gold bump fabrication method and semiconductor device fabrication method using the micro-hole plating method, semiconductor device App 20060118952 - Suzuki; Yoshihide ; et al. | 2006-06-08 |
| Apparatus for plating treatment App 20040206622 - Kawakami, Katsuji ; et al. | 2004-10-21 |
| Plating method and plating apparatus App 20040209464 - Sawai, Keiichi ; et al. | 2004-10-21 |
| Semiconductor device having contact opening smaller than test probe, and manufacturing process and inspecting method thereof Grant 6,717,263 - Sawai , et al. April 6, 2 | 2004-04-06 |
| Etching liquid App 20030100191 - Suzuki, Yoshihide ; et al. | 2003-05-29 |
| Semiconductor device, its manufacturing process, and its inspecting method App 20030080421 - Sawai, Keiichi ; et al. | 2003-05-01 |
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