loadpatents
name:-0.026212930679321
name:-0.016180992126465
name:-0.0053608417510986
SAWADA; Tomoaki Patent Filings

SAWADA; Tomoaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for SAWADA; Tomoaki.The latest application filed is for "conductive resin composition, circuit board fabricated using conductive resin composition, and method of manufacturing circuit board".

Company Profile
6.14.25
  • SAWADA; Tomoaki - Osaka JP
  • Sawada; Tomoaki - Tokyo JP
  • Sawada; Tomoaki - Iwata JP
  • SAWADA; Tomoaki - Iwata-shi JP
  • Sawada; Tomoaki - Koriyama JP
  • Sawada; Tomoaki - Koriyama-shi JP
  • Sawada; Tomoaki - Koriyamashi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Conductive Resin Composition, Circuit Board Fabricated Using Conductive Resin Composition, And Method Of Manufacturing Circuit Board
App 20220208411 - FUKAO; Tomohiro ;   et al.
2022-06-30
Stretchable Laminate, Material For Stretchable Device, And Stretchable Device
App 20220201850 - ABE; Takatoshi ;   et al.
2022-06-23
Circuit Mounted Article And Device
App 20220175057 - ABE; Takatoshi ;   et al.
2022-06-09
Fiber Sheet, And Layered Body, Circuit Board And Electronic Board Using Same
App 20220183154 - FUKAO; Tomohiro ;   et al.
2022-06-09
Resin composition, and resin film, metal foil with resin, metal clad laminate, wiring board, and circuit mount component using same
Grant 11,345,784 - Michigami , et al. May 31, 2
2022-05-31
Stretchable Circuit Board
App 20220167497 - FUKAO; Tomohiro ;   et al.
2022-05-26
Conductive resin composition and conductive structure using same
Grant 11,239,004 - Fukao , et al. February 1, 2
2022-02-01
Resin Composition, And Resin Film, Metal Foil With Resin, Metal Clad Laminate, Wiring Board, And Circuit Mount Component Using Same
App 20210363308 - MICHIGAMI; Kyosuke ;   et al.
2021-11-25
Elastic Circuit Board And Patch Device In Which Same Is Used
App 20210337660 - ABE; Takatoshi ;   et al.
2021-10-28
Thermally Curable Resin Composition And Film Obtained Therefrom
App 20210301137 - ABE; Takatoshi ;   et al.
2021-09-30
Elastic circuit board and patch device in which same is used
Grant 11,096,276 - Abe , et al. August 17, 2
2021-08-17
Elastic Circuit Board And Patch Device In Which Same Is Used
App 20210161004 - ABE; Takatoshi ;   et al.
2021-05-27
Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure
Grant 10,966,317 - Abe , et al. March 30, 2
2021-03-30
Conductive Resin Composition And Conductive Structure Using Same
App 20210027909 - FUKAO; Tomohiro ;   et al.
2021-01-28
Resin composition and film using same
Grant 10,791,624 - Sawada , et al. September 29, 2
2020-09-29
Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure
Grant 10,299,379 - Abe , et al.
2019-05-21
Sheet-shaped Stretchable Structure, And Resin Composition For Stretchable Resin Sheet And Stretchable Resin Sheet Used For The Structure
App 20190110361 - ABE; TAKATOSHI ;   et al.
2019-04-11
Conductive film, and touch panel, display, touch sensor, and solar cell using the same
Grant 10,109,390 - Sawada , et al. October 23, 2
2018-10-23
Resin Composition And Film Using Same
App 20180263113 - SAWADA; Tomoaki ;   et al.
2018-09-13
Resin composition and film using same
Grant 10,009,994 - Sawada , et al. June 26, 2
2018-06-26
Conductive Resin Composition And Electronic Circuit Member Using The Same
App 20180061519 - ABE; Takatoshi ;   et al.
2018-03-01
Electrically conductive film
Grant 9,839,119 - Sawada , et al. December 5, 2
2017-12-05
Structural member for electronic devices
Grant 9,802,397 - Abe , et al. October 31, 2
2017-10-31
Gypsum hardened body, gypsum panel, method for manufacturing gypsum hardened body, and method for manufacturing gypsum board
Grant 9,802,867 - Sudo , et al. October 31, 2
2017-10-31
Conductive Film, And Touch Panel, Display, Touch Sensor, And Solar Cell Using The Same
App 20170271043 - SAWADA; TOMOAKI ;   et al.
2017-09-21
Gypsum Hardened Body, Gypsum Panel, Method For Manufacturing Gypsum Hardened Body, And Method For Manufacturing Gypsum Board
App 20170073271 - SUDO; Ushio ;   et al.
2017-03-16
Method for manufacturing a wheel bearing apparatus
Grant 9,512,883 - Ogata , et al. December 6, 2
2016-12-06
Electrically conductive film
Grant 9,468,092 - Sawada , et al. October 11, 2
2016-10-11
Resin Composition And Film Using Same
App 20160264813 - SAWADA; Tomoaki ;   et al.
2016-09-15
Electorically Conductive Film
App 20160266668 - SAWADA; Tomoaki ;   et al.
2016-09-15
Structural Member For Electronic Devices
App 20160152016 - ABE; Takatoshi ;   et al.
2016-06-02
Sheet-shaped Stretchable Structure, And Resin Composition For Stretchable Resin Sheet And Stretchable Resin Sheet Used For The Structure
App 20160157343 - ABE; TAKATOSHI ;   et al.
2016-06-02
Electorically Conductive Film
App 20150373838 - SAWADA; Tomoaki ;   et al.
2015-12-24
Thermally Conductive Resin Composition
App 20150299550 - KUSUNOKI; Tomokazu ;   et al.
2015-10-22
Method For Manufacturing A Wheel Bearing Apparatus
App 20140096394 - OGATA; Yuuki ;   et al.
2014-04-10
Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board
Grant 8,344,262 - Tamiya , et al. January 1, 2
2013-01-01
Epoxy Resin Composition, Prepreg, And Laminate And Printed Wiring Board
App 20100096173 - Fujino; Kentaro ;   et al.
2010-04-22
Epoxy Resin Composition For Printed Wiring Board, Resin Composition Varnish, Prepreg, Metal Clad Laminate, Printed Wiring Board And Multilayer Printed Wiring Board
App 20100025094 - Tamiya; Hiroki ;   et al.
2010-02-04
Adhesive sheet with base for flexible printed wiring boards, production method therefor, multilayer flexible printed wiring board and flex-rigid printed wiring board
App 20090314523 - Ito; Katsuhiko ;   et al.
2009-12-24

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