| Patent | Date |
|---|
Tactile sensor that includes two sheets each having at least either flexibility or elasticity
Grant 10,365,172 - Tomita , et al. July 30, 2 | 2019-07-30 |
Flexible touch sensor and method of manufacturing the same
Grant 10,228,806 - Tomita , et al. | 2019-03-12 |
Tactile Sensor That Includes Two Sheets Each Having At Least Either Flexibility Or Elasticity
App 20180356301 - TOMITA; YOSHIHIRO ; et al. | 2018-12-13 |
Biological Sensor For Obtaining Information On Living Body
App 20180338719 - TOMITA; YOSHIHIRO ; et al. | 2018-11-29 |
Flexible substrate including stretchable sheet
Grant 9,844,133 - Tomita , et al. December 12, 2 | 2017-12-12 |
Electronic component package and method for manufacturing the same
Grant 9,825,209 - Mima , et al. November 21, 2 | 2017-11-21 |
Flexible Touch Sensor And Method Of Manufacturing The Same
App 20170300147 - TOMITA; Yoshihiro ; et al. | 2017-10-19 |
Flexible Substrate Including Stretchable Sheet
App 20170181277 - TOMITA; YOSHIHIRO ; et al. | 2017-06-22 |
Substrate Including Stretchable Sheet
App 20170181276 - SAWADA; SUSUMU ; et al. | 2017-06-22 |
Flexible optical substrate
Grant 9,678,272 - Sawada , et al. June 13, 2 | 2017-06-13 |
Light-emitting device and method for manufacturing the same
Grant 9,627,583 - Sawada , et al. April 18, 2 | 2017-04-18 |
Optical Content Display System
App 20170090848 - TOMITA; YOSHIHIRO ; et al. | 2017-03-30 |
Electronic component package and method for manufacturing same
Grant 9,595,651 - Yamashita , et al. March 14, 2 | 2017-03-14 |
Flexible Optical Substrate
App 20160356957 - SAWADA; SUSUMU ; et al. | 2016-12-08 |
Electronic component package and method for manufacturing same
Grant 9,449,944 - Sawada , et al. September 20, 2 | 2016-09-20 |
Semiconductor device and method for manufacturing the same
Grant 9,449,937 - Kawakita , et al. September 20, 2 | 2016-09-20 |
Electronic component package and method for manufacturing the same
Grant 9,425,122 - Kawakita , et al. August 23, 2 | 2016-08-23 |
Electronic part package
Grant 9,373,762 - Sawada , et al. June 21, 2 | 2016-06-21 |
Electronic component package and method of manufacturing same
Grant 9,368,469 - Nakatani , et al. June 14, 2 | 2016-06-14 |
Ceramic substrate composite and method for manufacturing ceramic substrate composite
Grant 9,320,155 - Kuroiwa , et al. April 19, 2 | 2016-04-19 |
Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package
Grant 9,236,338 - Nakatani , et al. January 12, 2 | 2016-01-12 |
Electronic Part Package
App 20150364661 - SAWADA; SUSUMU ; et al. | 2015-12-17 |
Light Emitting Device, Method For Manufacturing Same, And Body Having Light Emitting Device Mounted Thereon
App 20150280093 - Tomita; Yoshihiro ; et al. | 2015-10-01 |
Electronic Component Package And Method For Manufacturing Same
App 20150236233 - Yamashita; Yoshihisa ; et al. | 2015-08-20 |
Electronic Component Package And Method For Manufacturing Same
App 20150228619 - Sawada; Susumu ; et al. | 2015-08-13 |
Electronic Component Package And Method For Producing Same
App 20150221842 - Mima; Kazuma ; et al. | 2015-08-06 |
Electronic Component Package And Method For Manufacturing The Same
App 20150214129 - Kawakita; Koji ; et al. | 2015-07-30 |
Semiconductor Device And Method For Producing Same
App 20150155251 - Kawakita; Koji ; et al. | 2015-06-04 |
Light Emitting Apparatus And Method For Manufacturing Same
App 20150084080 - Kawakita; Koji ; et al. | 2015-03-26 |
Electronic Component Package And Method Of Manufacturing Same
App 20150076545 - Nakatani; Seiichi ; et al. | 2015-03-19 |
Light-emitting Device And Method For Manufacturing The Same
App 20150008467 - Sawada; Susumu ; et al. | 2015-01-08 |
Ceramic Substrate Composite And Method For Manufacturing Ceramic Substrate Composite
App 20140131076 - Kuroiwa; Taiji ; et al. | 2014-05-15 |
Built-up Substrate, Method For Manufacturing Same, And Semiconductor Integrated Circuit Package
App 20140124777 - Nakatani; Seiichi ; et al. | 2014-05-08 |
Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates
Grant 8,501,583 - Kitae , et al. August 6, 2 | 2013-08-06 |
Bump forming method using self-assembling resin and a wall surface
Grant 8,297,488 - Karashima , et al. October 30, 2 | 2012-10-30 |
Semiconductor device having semiconductor elements formed inside a resin film substrate
Grant 8,288,778 - Nakatani , et al. October 16, 2 | 2012-10-16 |
Transistor having an organic semiconductor with a hollow space
Grant 8,193,526 - Nakatani , et al. June 5, 2 | 2012-06-05 |
Flip chip connection structure having powder-like conductive substance and method of producing the same
Grant 8,097,958 - Sawada , et al. January 17, 2 | 2012-01-17 |
Parallel differential transmission lines having an opposing grounding conductor separated into two parts by a slot therein
Grant 8,040,200 - Minegishi , et al. October 18, 2 | 2011-10-18 |
Semiconductor Device, Method For Manufacturing The Same And Image Display
App 20110204367 - Nakatani; Seiichi ; et al. | 2011-08-25 |
Semiconductor Device, Method For Manufacturing The Same And Image Display
App 20110204366 - Nakatani; Seiichi ; et al. | 2011-08-25 |
Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates
Grant 7,919,357 - Sawada , et al. April 5, 2 | 2011-04-05 |
Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same
Grant 7,714,444 - Nakatani , et al. May 11, 2 | 2010-05-11 |
Method For Connecting Between Substrates, Flip-chip Mounting Structure, And Connection Structure Between Substrates
App 20100007033 - KITAE; Takashi ; et al. | 2010-01-14 |
Method For Mutually Connecting Substrates, Flip Chip Mounting Body, And Mutual Connection Structure Between Substrates
App 20100001411 - SAWADA; Susumu ; et al. | 2010-01-07 |
Differential Transmission Line Including Two Transmission Lines Parallel To Each Other
App 20090315649 - MINEGISHI; Akira ; et al. | 2009-12-24 |
Conductive Resin Composition, Connection Method Between Electrodes Using The Same, And Electric Connection Method Between Electronic Component And Circuit Substrate Using The Same
App 20090200522 - NAKATANI; Seiichi ; et al. | 2009-08-13 |
Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same
Grant 7,537,961 - Nakatani , et al. May 26, 2 | 2009-05-26 |
Connection Structure And Method Of Producing The Same
App 20090102064 - Sawada; Susumu ; et al. | 2009-04-23 |
Bump Forming Method And Bump Forming Apparatus
App 20090078746 - Karashima; Seiji ; et al. | 2009-03-26 |
Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method
App 20090008776 - Kitae; Takashi ; et al. | 2009-01-08 |
Conductive Resin Composition, Connection Method Between Electrodes Using The Same, And Electric Connection Method Between Electronic Component And Circuit Substrate Using The Same
App 20070216023 - Nakatani; Seiichi ; et al. | 2007-09-20 |
Thin-film forming apparatus
Grant 5,804,046 - Sawada , et al. September 8, 1 | 1998-09-08 |
High purity titanium sputtering targets
Grant 5,772,860 - Sawada , et al. June 30, 1 | 1998-06-30 |
Sputtering targets of high-purity aluminum or alloy thereof
Grant 5,456,815 - Fukuyo , et al. October 10, 1 | 1995-10-10 |
Method for providing single piece with plural different mechanical characteristics
Grant 4,323,404 - Sawada , et al. April 6, 1 | 1982-04-06 |
Welding apparatus
Grant 4,032,387 - Sugiyama , et al. June 28, 1 | 1977-06-28 |
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