SAWADA; Hidetsugu
Patent Applications and Registrations
Patent applications and USPTO patent grants for SAWADA; Hidetsugu.The latest application filed is for "molding material for thermocompression molding, molded article produced by using the same, and method for producing the same".
- SAWADA; Hidetsugu - Osaka JP
- Sawada; Hidetsugu - Sakura-shi JP
- Sawada; Hidetsugu - Moriyama JP
- Sawada, Hidetsugu - Moriyama-shi JP
| Patent | Date |
|---|---|
| Molding Material For Thermocompression Molding, Molded Article Produced By Using The Same, And Method For Producing The Same App 20180346669 - TAKAISHI; Shiori ; et al. | 2018-12-06 |
| Laminated Sheet For Thermoforming, Formed Product, Injection-molded Product, And Method Of Producing The Same App 20090104441 - Sawada; Hidetsugu ; et al. | 2009-04-23 |
| Thermoforming Method For Thermoforming Sheet And Thermoforming Apparatus App 20090039556 - Sawada; Hidetsugu ; et al. | 2009-02-12 |
| Anti-fogging thermoplastic resin sheet and formed article Grant 6,838,168 - Sawada , et al. January 4, 2 | 2005-01-04 |
| Anti-fogging thermoplastic resin sheet and formed article App 20030232209 - Sawada, Hidetsugu ; et al. | 2003-12-18 |
| Anti-fog resin sheet, anti-fog agent and method article App 20020045027 - Sawada, Hidetsugu ; et al. | 2002-04-18 |
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