Sawa; Shigeki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sawa; Shigeki.The latest application filed is for "solder ball loading mask, apparatus and associated methodology".
- Sawa; Shigeki - Gifu JP
- Sawa; Shigeki - Ibi-gun N/A JP
- Sawa; Shigeki - Yokohama JP
- Sawa; Shigeki - Kanazawa JP
| Patent | Date |
|---|---|
| Method of manufacturing a printed wiring board Grant 8,832,935 - Kawamura , et al. September 16, 2 | 2014-09-16 |
| Plating apparatus and plating method Grant 8,721,863 - Tachi , et al. May 13, 2 | 2014-05-13 |
| Printed wiring board Grant 8,624,132 - Kawamura , et al. January 7, 2 | 2014-01-07 |
| Solder ball loading mask, apparatus and associated methodology Grant 8,448,838 - Sawa , et al. May 28, 2 | 2013-05-28 |
| Printed wiring board Grant 8,198,546 - Kawamura , et al. June 12, 2 | 2012-06-12 |
| Solder ball loading mask, apparatus and associated methodology Grant 8,157,157 - Sawa , et al. April 17, 2 | 2012-04-17 |
| Solder Ball Loading Mask, Apparatus And Associated Methodology App 20120080504 - Sawa; Shigeki ; et al. | 2012-04-05 |
| Solder Ball Loading Mask, Apparatus and Associated Methodology App 20120080505 - Sawa; Shigeki ; et al. | 2012-04-05 |
| Plating Apparatus And Plating Method App 20120073977 - TACHI; Yasuaki ; et al. | 2012-03-29 |
| Plating apparatus and plating method Grant 8,128,790 - Tachi , et al. March 6, 2 | 2012-03-06 |
| Printed wiring board Grant 8,022,314 - Kawamura , et al. September 20, 2 | 2011-09-20 |
| Printed wiring board Grant 8,017,875 - Kawamura , et al. September 13, 2 | 2011-09-13 |
| Printed Wiring Board App 20110214915 - KAWAMURA; Yoichiro ; et al. | 2011-09-08 |
| Printed wiring board Grant 8,003,897 - Kawamura , et al. August 23, 2 | 2011-08-23 |
| Printed Wiring Board App 20110061232 - Kawamura; Yoichiro ; et al. | 2011-03-17 |
| Solder ball loading method and solder ball loading unit Grant 7,866,529 - Sumita , et al. January 11, 2 | 2011-01-11 |
| Printed Wiring Board App 20100155129 - KAWAMURA; Yoichiro ; et al. | 2010-06-24 |
| Printed wiring board Grant 7,714,233 - Kawamura , et al. May 11, 2 | 2010-05-11 |
| Printed Wiring Board App 20100065323 - Kawamura; Yoichiro ; et al. | 2010-03-18 |
| Solder Ball Loading Mask, Apparatus And Associated Methodology App 20090294516 - Sawa; Shigeki ; et al. | 2009-12-03 |
| Solder Ball Loading Method And Solder Ball Loading Unit App 20090084827 - SUMITA; Atsunori ; et al. | 2009-04-02 |
| Plating Apparatus And Plating Method App 20090032404 - Tachi; Yasuaki ; et al. | 2009-02-05 |
| Solder ball loading method and solder ball loading unit background of the invention Grant 7,475,803 - Sumita , et al. January 13, 2 | 2009-01-13 |
| Printed Wiring Board App 20080149369 - KAWAMURA; Yoichiro ; et al. | 2008-06-26 |
| Etching solution, method of etching and printed wiring board Grant 7,357,879 - Takahashi , et al. April 15, 2 | 2008-04-15 |
| Printed wiring board App 20070096327 - Kawamura; Yoichiro ; et al. | 2007-05-03 |
| Printed wiring board App 20070086147 - Kawamura; Yoichiro ; et al. | 2007-04-19 |
| Etching solution, method of etching and printed wiring board App 20060199394 - Takahashi; Tsunehisa ; et al. | 2006-09-07 |
| Solder ball loading method and solder ball loading unit background of the invention App 20060157540 - Sumita; Atsunori ; et al. | 2006-07-20 |
| Developing device with microfields formed on developer carrier Grant 5,424,814 - Suzuki , et al. June 13, 1 | 1995-06-13 |
| Method of curing athlete's foot by laser beam irradiation Grant 4,640,283 - Sawa , et al. February 3, 1 | 1987-02-03 |
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