Sawa Corporation
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sawa Corporation.The latest application filed is for "device for removing adhered substances".
- Sawa Corporation - Hirakata-shi JP
- Sawa Corporation - Kitatsuru-gun JP
- SAWA Corporation - Kitatsuru-gun, Yamanashi JP
| Patent | Date |
|---|---|
| Device for removing adhered substances Grant 8,595,891 - Okamoto , et al. December 3, 2 | 2013-12-03 |
| Automatic door closing hinge and double swing door structure Grant 8,510,911 - Sawa August 20, 2 | 2013-08-20 |
| Automatic door closing hinge and double swing door structure Grant 8,387,210 - Sawa March 5, 2 | 2013-03-05 |
| Device For Removing Adhered Substances App 20110277268 - Okamoto; Yoshihiro ; et al. | 2011-11-17 |
| Hinge For Automatically-closing Door Which Opens In Both Directions And Structure For Door Which Opening In Both Directions App 20100319260 - Sawa; Takashi | 2010-12-23 |
| Automatic Door Closing Hinge And Double Swing Door Structure App 20100263289 - Sawa; Takashi | 2010-10-21 |
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