Sautter; Kenneth M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sautter; Kenneth M..The latest application filed is for "method for efficient coating of substrates including plasma cleaning and dehydration".

Company Profile

0.16.1

Sautter; Kenneth M. - Sunnyvale CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for efficient coating of substrates including plasma cleaning and dehydration Grant 8,361,548 - Moffat , et al. January 29, 2	2013-01-29
Method for efficient coating of substrates including plasma cleaning and dehydration App 20100203260 - Moffat; William A. ; et al.	2010-08-12
Vertical interconnect process for silicon segments with dielectric isolation Grant 6,255,726 - Vindasius , et al. July 3, 2	2001-07-03
Vertical interconnect process for silicon segments Grant 6,188,126 - Pedersen , et al. February 13, 2	2001-02-13
Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform Grant 6,177,296 - Vindasius , et al. January 23, 2	2001-01-23
Conductive epoxy flip-chip package and method Grant 6,134,118 - Pedersen , et al. October 17, 2	2000-10-17
Vertical interconnect process for silicon segments with thermally conductive epoxy preform Grant 6,124,633 - Vindasius , et al. September 26, 2	2000-09-26
Method for forming vertical interconnect process for silicon segments with dielectric isolation Grant 6,080,596 - Vindasius , et al. June 27, 2	2000-06-27
Speaker diaphragm Grant 5,936,302 - Pedersen , et al. August 10, 1	1999-08-10
Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform Grant 5,891,761 - Vindasius , et al. April 6, 1	1999-04-06
Silicon segment programming method and apparatus Grant 5,698,895 - Pedersen , et al. December 16, 1	1997-12-16
Vertical interconnect process for silicon segments Grant 5,675,180 - Pedersen , et al. October 7, 1	1997-10-07
Vertical interconnect process for silicon segments Grant 5,661,087 - Pedersen , et al. August 26, 1	1997-08-26
Conductive epoxy flip-chip package and method Grant 5,657,206 - Pedersen , et al. August 12, 1	1997-08-12
In-line photoresist thickness monitor Grant 4,977,330 - Batchelder , et al. December 11, 1	1990-12-11
Resist development method Grant 4,647,172 - Batchelder , et al. March 3, 1	1987-03-03

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