Satriano; Robert J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Satriano; Robert J..The latest application filed is for "hermetically sealed ceramic package".
- Satriano; Robert J. - Hackettstown NJ
| Patent | Date |
|---|---|
| Hermetically sealed ceramic package Grant 7,281,946 - Nicoletta , et al. October 16, 2 | 2007-10-16 |
| Hermetically Sealed Ceramic Package App 20070190851 - Nicoletta; Dino ; et al. | 2007-08-16 |
| Hermetically sealed package App 20030068907 - Morte, Caesar ; et al. | 2003-04-10 |
| Method of packaging a semiconductor chip in a low inductance package Grant 5,105,536 - Neugebauer , et al. April 21, 1 | 1992-04-21 |
| Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s) Grant 5,049,973 - Satriano , et al. September 17, 1 | 1991-09-17 |
| High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip Grant 5,028,987 - Neugebauer , et al. July 2, 1 | 1991-07-02 |
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