Satou; Yutaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Satou; Yutaka.The latest application filed is for "semiconductor component and power module".

Company Profile

12.36.44

Satou; Yutaka - Ichihara JP
Satou; Yutaka - Saitama JP
Satou; Yutaka - Ibaraki JP
SATOU; Yutaka - Saitama-shi Saitama
Satou; Yutaka - Ichihara-shi JP
Satou; Yutaka - Chiba JP
Satou; Yutaka - Chihara-shi JP
Satou; Yutaka - Sakura JP
Satou; Yutaka - Sakura-shi JP
Satou; Yutaka - Chiba-shi JP
SATOU; Yutaka - Kitakatsushika-gun JP
Satou; Yutaka - Kawasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Active ester compound and composition and cured product obtained using the same Grant 11,407,708 - Satou , et al. August 9, 2	2022-08-09
Semiconductor component and power module Grant 11,348,855 - Satou , et al. May 31, 2	2022-05-31
Prismatic secondary battery Grant 11,322,790 - Egawa , et al. May 3, 2	2022-05-03
Active ester compound Grant 11,299,448 - Okamoto , et al. April 12, 2	2022-04-12
Semiconductor Component And Power Module App 20210225724 - SATOU; Yutaka ; et al.	2021-07-22
Curable composition and cured product thereof Grant 11,053,384 - Satou , et al. July 6, 2	2021-07-06
Active Ester Composition And Semiconductor Sealing Material App 20210139641 - Satou; Yutaka ; et al.	2021-05-13
Curable Composition And Cured Product Thereof App 20210032383 - Yamoto; Kazuhisa ; et al.	2021-02-04
Curable Composition And Cured Product Thereof App 20210009804 - Satou; Yutaka ; et al.	2021-01-14
Active ester composition and cured product thereof Grant 10,800,914 - Satou , et al. October 13, 2	2020-10-13
Active ester resin and cured product thereof Grant 10,741,464 - Satou , et al. A	2020-08-11
Active Ester Resin And Composition And Cured Product Using The Same App 20200216603 - Satou; Yutaka ; et al.	2020-07-09
Active Ester Compound And Composition And Cured Product Obtained Using The Same App 20200207700 - Satou; Yutaka ; et al.	2020-07-02
Active Ester Compound App 20200148618 - Okamoto; Tatsuya ; et al.	2020-05-14
Power module Grant 10,615,156 - Anzai , et al.	2020-04-07
Epoxy compound, epoxy resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board Grant 10,435,382 - Satou , et al. O	2019-10-08
Active Ester Resin Composition And Cured Product Of Same App 20190225744 - Kawasaki; Akito ; et al.	2019-07-25
Power Module App 20190181128 - ANZAI; Takeshi ; et al.	2019-06-13
Curable Composition And Cured Product Thereof App 20190169424 - Satou; Yutaka ; et al.	2019-06-06
Active Ester Resin And Cured Product Thereof App 20190172768 - Satou; Yutaka ; et al.	2019-06-06
Prismatic Secondary Battery App 20190173062 - EGAWA; Hiroaki ; et al.	2019-06-06
Active Ester Composition And Cured Product Thereof App 20190153215 - Satou; Yutaka ; et al.	2019-05-23
Epoxy resin, curable resin composition, cured product, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, buildup film, buildup substrate, fiber-reinforced composite material and fiber-reinforced molded article Grant 10,113,028 - Hirota , et al. October 30, 2	2018-10-30
Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board Grant 10,081,585 - Satou , et al. September 25, 2	2018-09-25
Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board Grant 10,011,676 - Satou , et al. July 3, 2	2018-07-03
Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board Grant 9,902,798 - Satou , et al. February 27, 2	2018-02-27
Epoxy compound, epoxy resin, curable compound, cured product thereof, semiconductor sealing material, and printed circuit board Grant 9,890,237 - Satou , et al. February 13, 2	2018-02-13
Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board Grant 9,765,173 - Satou , et al. September 19, 2	2017-09-19
Epoxy Resin, Curable Resin Composition, Cured Product, Semiconductor Encapsulating Material, Semiconductor Device, Prepreg, Circuit Board, Buildup Film, Buildup Substrate, Fiber-reinforced Composite Material And Fiber-reinforced Molded Article App 20170240690 - HIROTA; Yousuke ; et al.	2017-08-24
Epoxy resin, curable resin composition, cured product thereof, and printed circuit board Grant 9,736,926 - Satou August 15, 2	2017-08-15
Phenolic-hydroxyl-containing resin, epoxy resin, curable resin composition, substance obtained by curing same, and semiconductor sealant Grant 9,580,634 - Nagae , et al. February 28, 2	2017-02-28
Epoxy Compound, Epoxy Resin, Curable Compound, Cured Product Thereof, Semiconductor Sealing Material, And Printed Circuit Board App 20160369041 - Satou; Yutaka ; et al.	2016-12-22
Compound Containing Phenolic Hydroxyl Group, Phenolic Resin, Curable Composition, Cured Product Thereof, Semiconductor Sealing Material, And Printed Circuit Board App 20160369032 - Satou; Yutaka ; et al.	2016-12-22
Compound Containing Phenolic Hydroxyl Group, Phenolic Resin, Curable Composition, Cured Product Thereof, Semiconductor Sealing Material, And Printed Circuit Board App 20160137770 - Satou; Yutaka ; et al.	2016-05-19
Compound Containing Phenolic Hydroxyl Group, Phenolic Resin, Curable Composition, Cured Product Thereof, Semiconductor Sealing Material, And Printed Circuit Board App 20160137771 - Satou; Yutaka ; et al.	2016-05-19
Epoxy Compound, Epoxy Resin, Curable Composition, Cured Product Thereof, Semiconductor Sealing Material, And Printed Circuit Board App 20160130243 - Satou; Yutaka ; et al.	2016-05-12
Compound Containing Phenolic Hydroxyl Group, Phenolic Resin, Curable Composition, Cured Product Thereof, Semiconductor Sealing Material, And Printed Circuit Board App 20160122269 - Satou; Yutaka ; et al.	2016-05-05
Phenolic-hydroxyl-containing Resin, Epoxy Resin, Curable Resin Composition, Substance Obtained By Curing Same, And Semiconductor Sealant App 20150291861 - Nagae; Norio ; et al.	2015-10-15
Epoxy Resin, Curable Resin Composition, Cured Product Thereof, And Printed Circuit Board App 20150257257 - Satou; Yutaka	2015-09-10
Epoxy Resin, Curable Resin Composition, Cured Product Thereof, And Printed Circuit Board App 20150252136 - Satou; Yutaka	2015-09-10
Epoxy resin, curable resin composition and cured product thereof, and printed wiring board Grant 9,125,309 - Satou September 1, 2	2015-09-01
Phosphorus-atom-containing oligomer composition, curable resin composition, cured product thereof, and printed circuit board Grant 9,056,990 - Hayashi , et al. June 16, 2	2015-06-16
Phosphorus-containing oligomer and method for producing the same, curable resin composition and cured product of the same, and printed wiring board Grant 9,045,508 - Hayashi , et al. June 2, 2	2015-06-02
Epoxy Resin, Curable Resin Composition And Cured Product Thereof, And Printed Wiring Board App 20140287241 - Satou; Yutaka	2014-09-25
Phosphorus-atom-containing Oligomer Composition, Curable Resin Composition, Cured Product Thereof, And Printed Circuit Board App 20140008108 - Hayashi; Koji ; et al.	2014-01-09
Phosphorus-containing Oligomer And Method For Producing The Same, Curable Resin Composition And Cured Product Of The Same, And Printed Wiring Board App 20130296597 - Hayashi; Koji ; et al.	2013-11-07
Epoxy compound, curable composition, and cured product thereof Grant 8,519,065 - Satou August 27, 2	2013-08-27
Phosphorus-containing oligomer and method for producing the same, curable resin composition and cured product of the same, and printed wiring board Grant 8,512,466 - Hayashi , et al. August 20, 2	2013-08-20
Epoxy Compound, Curable Composition, And Cured Product Thereof App 20130144030 - Satou; Yutaka	2013-06-06
Novel Phenol Resin, Curable Resin Composition, Cured Article Thereof, And Printed Wiring Board App 20130131215 - Satou; Yutaka	2013-05-23
Phenol resin composition, production method therefor, curable resin composition, cured product thereof, and printed circuit board Grant 8,394,911 - Satou , et al. March 12, 2	2013-03-12
Phosphorus-containing Oligomer And Method For Producing The Same, Curable Resin Composition And Cured Product Of The Same, And Printed Wiring Board App 20130040147 - Hayashi; Koji ; et al.	2013-02-14
Electric compressor Grant 8,360,752 - Watanabe , et al. January 29, 2	2013-01-29
Phenol Resin Composition, Production Method Therefor, Curable Resin Composition, Cured Product Thereof, And Printed Circuit Board App 20120308832 - Satou; Yutaka ; et al.	2012-12-06
Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin Grant 8,263,714 - Ogura , et al. September 11, 2	2012-09-11
Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same Grant 8,168,731 - Satou , et al. May 1, 2	2012-05-01
Epoxy Resin Composition, Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin, Method For Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin App 20110275739 - Ogura; Ichiro ; et al.	2011-11-10
Curable Resin Composition, Cured Product Thereof, Printed Wiring Board, Epoxy Resin, And Process For Producing The Same App 20110259628 - Satou; Yutaka ; et al.	2011-10-27
Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resin Grant 7,985,822 - Ogura , et al. July 26, 2	2011-07-26
Semiconductor memory device Grant 7,835,188 - Satou , et al. November 16, 2	2010-11-16
Electric Compressor App 20100074773 - Watanabe; Toshiharu ; et al.	2010-03-25
Electric Compressor App 20100021320 - Watanabe; Toshiharu ; et al.	2010-01-28
Semiconductor Memory Device App 20090190407 - Satou; Yutaka ; et al.	2009-07-30
Electric Compressor Manufacturing Method And Electric Compressor App 20090104055 - SATOU; Yutaka ; et al.	2009-04-23
Electronic apparatus Grant 7,440,267 - Tatsukami , et al. October 21, 2	2008-10-21
Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin App 20080255315 - Ogura; Ichiro ; et al.	2008-10-16
Electronic apparatus Grant 7,349,201 - Tatsukami , et al. March 25, 2	2008-03-25
Electronic apparatus App 20060056144 - Tatsukami; Ikki ; et al.	2006-03-16
Electronic apparatus App 20060056143 - Tatsukami; Ikki ; et al.	2006-03-16

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